Datasheet STM32WB5MMG (STMicroelectronics) - 22
| 制造商 | STMicroelectronics |
| 描述 | Bluetooth Low Energy 5.0 and 802.15.4 module |
| 页数 / 页 | 31 / 22 — STM32WB5MMG. Ordering information. Device family. Product type. Device … |
| 文件格式/大小 | PDF / 3.7 Mb |
| 文件语言 | 英语 |
STM32WB5MMG. Ordering information. Device family. Product type. Device subfamily. Pin count. Component type. Flash memory size. Package
该数据表的模型线
文件文字版本
STM32WB5MMG Ordering information 10 Ordering information
Example: STM32 WB 5 M M G H 6 TR
Device family
STM32 = Arm-based 32-bit microcontroller
Product type
WB = Wireless Bluetooth®
Device subfamily
5 = STM32WB55, Die 5, full set of features
Pin count
M = 86 pins
Component type
M= module
Flash memory size
G = 1 Mbyte
Package
H = LGA 86 7.3 x 11 mm
Temperature range
6 = Industrial temperature range, –40 to 85 °C
Packing
TR = tape and reel For a list of available options (such as speed and package) or for further information on any aspect of this device, contact your nearest ST sales office.
DS13252
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Rev 1 page 22/31
Document Outline 1 Introduction 2 Description 3 Available peripherals 4 Pin description 5 Recommendations 5.1 Pin recommendations 5.2 Layout recommendations 5.2.1 STM32WB5MMG placement 5.2.2 Enclosure effects 5.2.3 Ground plane 5.2.4 Sensitive GPIOs 5.2.5 Four layer reference board design 6 Electrical characteristics 6.1 Operating conditions 6.2 Power consumption 6.3 RF characteristics 6.4 Antenna radiation patterns and efficiency 7 Thermal characteristics 8 Solder re-flow recommendation 9 Package information 9.1 SiP-LGA86 package information 9.1.1 Device marking for SiP-LGA86 10 Ordering information 11 Tape and reel packing 12 Certification 12.1 CE certification 12.2 FCC certification 12.3 ISED certification 12.4 JRF certification 12.5 NCC certification 12.6 SRRC certification Revision history Contents List of tables List of figures
Example: STM32 WB 5 M M G H 6 TR
Device family
STM32 = Arm-based 32-bit microcontroller
Product type
WB = Wireless Bluetooth®
Device subfamily
5 = STM32WB55, Die 5, full set of features
Pin count
M = 86 pins
Component type
M= module
Flash memory size
G = 1 Mbyte
Package
H = LGA 86 7.3 x 11 mm
Temperature range
6 = Industrial temperature range, –40 to 85 °C
Packing
TR = tape and reel For a list of available options (such as speed and package) or for further information on any aspect of this device, contact your nearest ST sales office.
DS13252
-
Rev 1 page 22/31
Document Outline 1 Introduction 2 Description 3 Available peripherals 4 Pin description 5 Recommendations 5.1 Pin recommendations 5.2 Layout recommendations 5.2.1 STM32WB5MMG placement 5.2.2 Enclosure effects 5.2.3 Ground plane 5.2.4 Sensitive GPIOs 5.2.5 Four layer reference board design 6 Electrical characteristics 6.1 Operating conditions 6.2 Power consumption 6.3 RF characteristics 6.4 Antenna radiation patterns and efficiency 7 Thermal characteristics 8 Solder re-flow recommendation 9 Package information 9.1 SiP-LGA86 package information 9.1.1 Device marking for SiP-LGA86 10 Ordering information 11 Tape and reel packing 12 Certification 12.1 CE certification 12.2 FCC certification 12.3 ISED certification 12.4 JRF certification 12.5 NCC certification 12.6 SRRC certification Revision history Contents List of tables List of figures