Datasheet LTC7802-3.3 (Analog Devices) - 5

link to page 2 link to page 24 link to page 24 link to page 15 LTC7802-3.3
ELECTRICAL CHARACTERISTICS Note 1:
Stresses beyond those listed under Absolute Maximum Ratings
Note 3:
When SENSE1– ≥ 3.2V or EXTVCC ≥ 4.8V, VIN supply current may cause permanent damage to the device. Exposure to any Absolute is transferred to these pins to reduce the total input supply quiescent Maximum Rating condition for extended periods may affect device current. SENSE1– bias current is reflected to the channel 1 input supply by reliability and lifetime. the formula IVIN1 = ISENSE1– • VOUT1/(VIN1 • η), where η is the efficiency.
Note 2:
The LTC7802-3.3 is tested under pulsed load conditions such EXTVCC bias current is similarly reflected to the input supply when biased that T by an output. Input supply current is minimized when EXTV J ≈ TA. The LTC7802E-3.3 is guaranteed to meet specifications CC is connected from 0°C to 85°C junction temperature. Specifications over the –40°C to the lowest output-derived voltage greater than 4.8V. to 125°C operating junction temperature range are assured by design,
Note 4:
The LTC7802-3.3 is tested in a feedback loop that servos VITH1,2 characterization and correlation with statistical process controls. The to a specified voltage and measures the resultant VOUT1, VFB2. LTC7802I-3.3 is guaranteed over the –40°C to 125°C operating junction
Note 5:
Dynamic supply current is higher due to the gate charge being temperature range, and the LTC7802J-3.30/LTC7802H-3.3 are guaranteed delivered at the switching frequency. See Applications information. over the –40°C to 150°C operating junction temperature range. High
Note 6:
Rise and fall times are measured using 10% and 90% levels. Delay junction temperatures degrade operating lifetimes; operating lifetime times are measured using 50% levels. is derated for junction temperatures greater than 125°C. Note that the maximum ambient temperature consistent with these specifications is
Note 7:
The minimum on-time condition is specified for an inductor determined by specific operating conditions in conjunction with board peak-to-peak ripple current >40% of IL(MAX) (See Minimum On-Time layout, the rated package thermal impedance and other environmental Considerations in the Applications Information section). factors. The junction temperature (T
Note 8:
This IC includes overtemperature protection that is intended to J, in °C) is calculated from the ambient temperature (T protect the device during momentary overload conditions. The maximum A, in °C) and power dissipation (PD, in Watts) according to the formula: T rated junction temperature will be exceeded when this protection is active. J = TA + (PD • θJA), where θJA (in °C/W) is the package thermal impedance. Continuous operation above the specified absolute maximum operating junction temperature may impair device reliability or permanently damage the device.
Note 9:
Do not apply a voltage or current source to these pins. They must be connected to capacitive loads only, otherwise permanent damage may occur. Rev. 0 For more information www.analog.com 5 Document Outline Features Applications Typical Application Description Absolute Maximum Ratings Order Information Pin Configuration Electrical Characteristics Typical Performance Characteristics Pin Functions Functional Diagram Operation Applications Information Typical Applications Package Description Typical Application Related Parts