Datasheet DA9130 (Dialog Semiconductor) - 2

制造商Dialog Semiconductor
描述High-Performance, 10 A, Dual-Phase DC-DC Converter
页数 / 页44 / 2 — DA9130. High-Performance, 10 A, Dual-Phase DC-DC. Converter. …
文件格式/大小PDF / 1.0 Mb
文件语言英语

DA9130. High-Performance, 10 A, Dual-Phase DC-DC. Converter. Applications. Datasheet. Revision 1.0. 31-Aug-2020

DA9130 High-Performance, 10 A, Dual-Phase DC-DC Converter Applications Datasheet Revision 1.0 31-Aug-2020

该数据表的模型线

文件文字版本

DA9130 High-Performance, 10 A, Dual-Phase DC-DC Converter
■ Optimized BoM cost and footprint: Each output requires a very small inductor and capacitor delivering parts and cost savings ■ Cycle by cycle current limiting for superior over-current protection
Applications
■ Switches and routers ■ Consumer products ■ Smart metering ■ SoC/FPGA high performance processing ■ Industrial automation system requiring efficient, high current, power delivery ■ Wireless
Datasheet Revision 1.0 31-Aug-2020
CFR0011-120-00 2 of 44 © 2020 Dialog Semiconductor

Document Outline General Description Key Features Benefits Applications System Diagrams Contents Table of Figures Table of Tables 1 Terms and Definitions 2 Pinout 3 Characteristics 3.1 Absolute Maximum Ratings 3.2 Recommended Operating Conditions 3.3 Thermal Characteristics 3.3.1 Thermal Ratings 3.3.2 Power Dissipation 3.4 ESD Characteristics 3.5 Buck Characteristics 3.6 Performance and Supervision Characteristics 3.7 Digital IO Characteristics 3.8 Timing Characteristics 3.9 Typical Performance 4 Functional Description 4.1 DC-DC Buck Converter 4.1.1 Switching Frequency 4.1.2 Operation Modes and Phase Selection 4.1.3 Output Voltage Selection 4.1.4 Soft Start-Up and Shutdown 4.1.5 Current Limit 4.1.6 Resistive Divider 4.1.7 Thermal Protection 4.2 Internal Circuits 4.2.1 IC_EN/Chip Enable/Disable 4.2.2 nIRQ/Interrupt 4.2.3 GPIO 4.2.3.1 GPIO Pin Assignment 4.2.3.2 GPIO Function 4.2.3.3 Chip Configuration Select (CONF) 4.3 Operating Modes 4.3.1 ON 4.3.2 OFF 4.4 I2C Communication 4.4.1 I2C Protocol 5 Register Definitions 5.1 Register Map 5.1.1 System 5.1.2 Buck1 5.1.3 Serialization 6 Package Information 6.1 Package Outlines 6.2 Moisture Sensitivity Level 6.3 Soldering Information 7 Ordering Information 8 Application Information 8.1 Capacitor Selection 8.2 Inductor Selection