Datasheet ADP1706, ADP1707, ADP1708 (Analog Devices) - 8
| 制造商 | Analog Devices |
| 描述 | 1 A, Low Dropout, CMOS Linear Regulator |
| 页数 / 页 | 20 / 8 — ADP1706/ADP1707/ADP1708. Data Sheet. EN 1. 8 ADJ. GND 2. ADP1708. 7 … |
| 修订版 | A |
| 文件格式/大小 | PDF / 531 Kb |
| 文件语言 | 英语 |
ADP1706/ADP1707/ADP1708. Data Sheet. EN 1. 8 ADJ. GND 2. ADP1708. 7 SENSE. IN 3. TOP VIEW. 6 OUT. (Not to Scale). IN 4. 5 OUT. NOTES
该数据表的模型线
- ADP1706ACPZ-1.05R7 ADP1706ACPZ-1.2-R7 ADP1706ACPZ-1.3-R7 ADP1706ACPZ-1.5-R7 ADP1706ACPZ-2.5-R7 ADP1706ACPZ-3.3-R7 ADP1706ARDZ-1.15R7 ADP1706ARDZ-1.2-R7 ADP1706ARDZ-1.3-R7 ADP1706ARDZ-1.5-R7 ADP1706ARDZ-1.8-R7 ADP1706ARDZ-2.5-R7 ADP1706ARDZ-3.0-R7 ADP1706ARDZ-3.3-R7
文件文字版本
ADP1706/ADP1707/ADP1708 Data Sheet EN 1 8 ADJ EN 1 8 ADJ GND 2 ADP1708 7 SENSE GND 2 7 SENSE ADP1708 IN 3 TOP VIEW 6 OUT TOP VIEW (Not to Scale) IN 3 6 OUT (Not to Scale) IN 4 5 OUT IN 4 5 OUT NOTES NOTES 1. EXPOSED PAD. THE EXPOSED PAD ENHANCES THERMAL PERFORMANCE 1. EXPOSED PAD. THE EXPOSED PAD ENHANCES THERMAL PERFORMANCE AND IS ELECTRICALLY CONNECTED TO GND INSIDE THE PACKAGE. IT IS
5 8
AND IS ELECTRICALLY CONNECTED TO GND INSIDE THE PACKAGE. IT IS
-00
RECOMMENDED TO CONNECT THE EXPOSED PAD TO THE GROUND PLANE
-00
RECOMMENDED TO CONNECT THE EXPOSED PAD TO THE GROUND PLANE
640
ON THE BOARD.
640 06
ON THE BOARD.
06 Figure 8. 8-Lead SOIC, ADP1708 Figure 9. 8-Lead LFCSP, ADP1708
Table 6. ADP1708 Pi n Function Descriptions Pin No. SOIC LFCSP Mnemonic Description
1 1 EN Enable Input. Drive EN high to turn on the regulator; drive it low to turn off the regulator. For automatic startup, connect EN to IN. 2 2 GND Ground. 3, 4 3, 4 IN Regulator Input Supply. Bypass IN to GND with a 4.7 μF or greater capacitor. 5, 6 5, 6 OUT Regulated Output Voltage. Bypass OUT to GND with a 4.7 μF or greater capacitor. 7 7 SENSE Sense. Measures the actual output voltage at the load and feeds it to the error amplifier. Connect SENSE as close as possible to the load to minimize the effect of IR drop between the regulator output and the load. 8 8 ADJ Adjust. A resistor divider from OUT to ADJ sets the output voltage. 0 0 EP Exposed Pad. The exposed pad enhances thermal performance and is electrically connected to GND inside the package. It is recommended to connect the exposed pad to the ground plane on the board. Rev. A | Page 8 of 20 Document Outline FEATURES APPLICATIONS TYPICAL APPLICATION CIRCUITS GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION SOFT START FUNCTION (ADP1706) ADJUSTABLE OUTPUT VOLTAGE (ADP1708) TRACK MODE (ADP1707) ENABLE FEATURE APPLICATIONS INFORMATION CAPACITOR SELECTION Output Capacitor Input Bypass Capacitor Input and Output Capacitor Properties VOLTAGE TRACKING APPLICATIONS CURRENT LIMIT AND THERMAL OVERLOAD PROTECTION THERMAL CONSIDERATIONS PCB LAYOUT CONSIDERATIONS OUTLINE DIMENSIONS ORDERING GUIDE NOTES
5 8
AND IS ELECTRICALLY CONNECTED TO GND INSIDE THE PACKAGE. IT IS
-00
RECOMMENDED TO CONNECT THE EXPOSED PAD TO THE GROUND PLANE
-00
RECOMMENDED TO CONNECT THE EXPOSED PAD TO THE GROUND PLANE
640
ON THE BOARD.
640 06
ON THE BOARD.
06 Figure 8. 8-Lead SOIC, ADP1708 Figure 9. 8-Lead LFCSP, ADP1708
Table 6. ADP1708 Pi n Function Descriptions Pin No. SOIC LFCSP Mnemonic Description
1 1 EN Enable Input. Drive EN high to turn on the regulator; drive it low to turn off the regulator. For automatic startup, connect EN to IN. 2 2 GND Ground. 3, 4 3, 4 IN Regulator Input Supply. Bypass IN to GND with a 4.7 μF or greater capacitor. 5, 6 5, 6 OUT Regulated Output Voltage. Bypass OUT to GND with a 4.7 μF or greater capacitor. 7 7 SENSE Sense. Measures the actual output voltage at the load and feeds it to the error amplifier. Connect SENSE as close as possible to the load to minimize the effect of IR drop between the regulator output and the load. 8 8 ADJ Adjust. A resistor divider from OUT to ADJ sets the output voltage. 0 0 EP Exposed Pad. The exposed pad enhances thermal performance and is electrically connected to GND inside the package. It is recommended to connect the exposed pad to the ground plane on the board. Rev. A | Page 8 of 20 Document Outline FEATURES APPLICATIONS TYPICAL APPLICATION CIRCUITS GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION SOFT START FUNCTION (ADP1706) ADJUSTABLE OUTPUT VOLTAGE (ADP1708) TRACK MODE (ADP1707) ENABLE FEATURE APPLICATIONS INFORMATION CAPACITOR SELECTION Output Capacitor Input Bypass Capacitor Input and Output Capacitor Properties VOLTAGE TRACKING APPLICATIONS CURRENT LIMIT AND THERMAL OVERLOAD PROTECTION THERMAL CONSIDERATIONS PCB LAYOUT CONSIDERATIONS OUTLINE DIMENSIONS ORDERING GUIDE NOTES