Datasheet LT3093 (Analog Devices) - 31
| 制造商 | Analog Devices |
| 描述 | –20V, 200mA, Ultralow Noise, Ultrahigh PSRR Negative Linear Regulator |
| 页数 / 页 | 32 / 31 — PACKAGE DESCRIPTION. MSE Package. 12-Lead Plastic MSOP, Exposed Die Pad. … |
| 文件格式/大小 | PDF / 4.3 Mb |
| 文件语言 | 英语 |
PACKAGE DESCRIPTION. MSE Package. 12-Lead Plastic MSOP, Exposed Die Pad. NO MEASUREMENT PURPOSE
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LT3093
PACKAGE DESCRIPTION MSE Package 12-Lead Plastic MSOP, Exposed Die Pad
(Reference LTC DWG # 05-08-1666 Rev G) BOTTOM VIEW OF EXPOSED PAD OPTION 2.845 ±0.102 2.845 ±0.102 (.112 ±.004) (.112 ±.004) 0.889 ±0.127 (.035 ±.005) 1 6 0.35 REF 5.10 1.651 ±0.102 1.651 ±0.102 (.201) 3.20 – 3.45 (.065 ±.004) 0.12 REF (.065 ±.004) MIN (.126 – .136) DETAIL “B” CORNER TAIL IS PART OF DETAIL “B” THE LEADFRAME FEATURE. 12 7 FOR REFERENCE ONLY
NO MEASUREMENT PURPOSE
0.42 ±0.038 0.65 4.039 ±0.102 (.0165 ±.0015) (.0256) (.159 ±.004) TYP BSC (NOTE 3) RECOMMENDED SOLDER PAD LAYOUT 0.406 ±0.076 12 11 10 9 8 7 (.016 ±.003) REF DETAIL “A” 0.254 (.010) 0° – 6° TYP 3.00 ±0.102 4.90 ±0.152 (.118 ±.004) GAUGE PLANE (.193 ±.006) (NOTE 4) 0.53 ±0.152 (.021 ±.006) 1 2 3 4 5 6 DETAIL “A” 1.10 0.86 0.18 (.043) (.034) (.007) MAX REF SEATING PLANE 0.22 – 0.38 0.1016 ±0.0508 (.009 – .015) (.004 ±.002) TYP 0.650 MSOP (MSE12) 0213 REV G NOTE: (.0256) 1. DIMENSIONS IN MILLIMETER/(INCH) BSC 2. DRAWING NOT TO SCALE 3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE 4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS. INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE 5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX 6. EXPOSED PAD DIMENSION DOES INCLUDE MOLD FLASH. MOLD FLASH ON E-PAD SHALL NOT EXCEED 0.254mm (.010") PER SIDE. Rev. 0 Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications For more information www.a subject to change without notice. No license is granted by implication or othernalog.com wise under any patent or patent rights of Analog Devices. 31 Document Outline Features Applications Typical Application Description Absolute Maximum Ratings Pin Configuration Order Information Electrical Characteristics Typical Performance Characteristics Pin Functions Block Diagram Applications Information Typical Application Package Description Typical Application Related Parts
PACKAGE DESCRIPTION MSE Package 12-Lead Plastic MSOP, Exposed Die Pad
(Reference LTC DWG # 05-08-1666 Rev G) BOTTOM VIEW OF EXPOSED PAD OPTION 2.845 ±0.102 2.845 ±0.102 (.112 ±.004) (.112 ±.004) 0.889 ±0.127 (.035 ±.005) 1 6 0.35 REF 5.10 1.651 ±0.102 1.651 ±0.102 (.201) 3.20 – 3.45 (.065 ±.004) 0.12 REF (.065 ±.004) MIN (.126 – .136) DETAIL “B” CORNER TAIL IS PART OF DETAIL “B” THE LEADFRAME FEATURE. 12 7 FOR REFERENCE ONLY
NO MEASUREMENT PURPOSE
0.42 ±0.038 0.65 4.039 ±0.102 (.0165 ±.0015) (.0256) (.159 ±.004) TYP BSC (NOTE 3) RECOMMENDED SOLDER PAD LAYOUT 0.406 ±0.076 12 11 10 9 8 7 (.016 ±.003) REF DETAIL “A” 0.254 (.010) 0° – 6° TYP 3.00 ±0.102 4.90 ±0.152 (.118 ±.004) GAUGE PLANE (.193 ±.006) (NOTE 4) 0.53 ±0.152 (.021 ±.006) 1 2 3 4 5 6 DETAIL “A” 1.10 0.86 0.18 (.043) (.034) (.007) MAX REF SEATING PLANE 0.22 – 0.38 0.1016 ±0.0508 (.009 – .015) (.004 ±.002) TYP 0.650 MSOP (MSE12) 0213 REV G NOTE: (.0256) 1. DIMENSIONS IN MILLIMETER/(INCH) BSC 2. DRAWING NOT TO SCALE 3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE 4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS. INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE 5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX 6. EXPOSED PAD DIMENSION DOES INCLUDE MOLD FLASH. MOLD FLASH ON E-PAD SHALL NOT EXCEED 0.254mm (.010") PER SIDE. Rev. 0 Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications For more information www.a subject to change without notice. No license is granted by implication or othernalog.com wise under any patent or patent rights of Analog Devices. 31 Document Outline Features Applications Typical Application Description Absolute Maximum Ratings Pin Configuration Order Information Electrical Characteristics Typical Performance Characteristics Pin Functions Block Diagram Applications Information Typical Application Package Description Typical Application Related Parts