Datasheet ADRV9009 (Analog Devices) - 120

link to page 120
ADRV9009 Data Sheet Advanced Design System (ADS) Setup Using the
1. The DataAccessComponent block reads the
rf port.s1p DataAccessComponent and SEDZ File
file. This file is the device RF port reflection coefficient. Analog Devices supplies the port impedance as an
.s1p
file that 2. The two equations convert the RF port reflection coefficient to can be downloaded from the ADRV9009 product page. This a complex impedance. The result is the RX_SEDZ variable. format allows simple interfacing to the ADS by using the 3. The RF port calculated complex impedance (RX_SEDZ) DataAccessComponent. In Figure 453, Term 1 is the single- defines the Term 2 impedance. ended input or output, and Term 2 is the differential input or 4. Term 2 is used in a differential mode, and Term 1 is used in output RF port on the ADRV9009. The pi on the single-ended a single-ended mode. side and the differential pi configuration on the differential side Setting up the simulation this way allows the user to measure allow maximum flexibility in designing matching circuits. The the input reflection (S11), output reflection (S22), and through pi configuration is suggested for all design layouts because the reflection (S21) of the three-port system without complex math pi configuration can step the impedance up or down as needed operations within the display page. with appropriate component population. For the highest accuracy, the electromagnetic momentum (EM) Take the following steps to set up a simulation for impedance modeling result of the PCB artwork, S11, S22, and S21 of the measurement and impedance matching: matching components and balun must be used in the simulations. 3 46 9- 49 16 Figure 453. Simulation Setup in ADS with SEDZ
.s1p
Files and DataAccessComponent
Table 11. Sample Wire Wound DC Bias Choke Resistance vs. Size vs. Inductance Inductance (nH) Resistance (Size: 0603) (Ω) Resistance (Size: 1206) (Ω)
100 0.10 0.08 200 0.15 0.10 300 0.16 0.12 400 0.28 0.14 500 0.45 0.15 600 0.52 0.20 Rev. B | Page 120 of 127 Document Outline Features Applications General Description Revision History Functional Block Diagram Specifications Current and Power Consumption Specifications Timing Diagrams Absolute Maximum Ratings Reflow Profile Thermal Management Thermal Resistance ESD Caution Pin Configuration and Function Descriptions Typical Performance Characteristics 75 MHz to 525 MHz Band 650 MHz to 3000 MHz Band 3400 MHz to 4800 MHz Band 5100 MHz to 5900 MHz Band Transmitter Output Impedance Observation Receiver Input Impedance Receiver Input Impedance Terminology Theory of Operation Transmitter Receiver Observation Receiver Clock Input Synthesizers RF PLL Clock PLL SPI JTAG Boundary Scan Power Supply Sequence GPIO_x Pins Auxiliary Converters AUXADC_x Auxiliary DAC x JESD204B Data Interface Applications Information PCB Layout and Power Supply Recommendations Overview PCB Material and Stackup Selection Fanout and Trace Space Guidelines Component Placement and Routing Guidelines Signals with Highest Routing Priority Signals with Second Routing Priority Signals with Lowest Routing Priority RF and JESD204B Transmission Line Layout RF Routing Guidelines Transmitter Balun DC Feed Supplies JESD204B Trace Routing Recommendations Routing Recommendations Stripline Transmission Lines vs. Microstrip Transmission Lines Isolation Techniques Used on the ADRV9009-W/PCBZ Isolation Goals Isolation Between JESD204B Lines RF Port Interface Information RF Port Impedance Data Advanced Design System (ADS) Setup Using the DataAccessComponent and SEDZ File Transmitter Bias and Port Interface General Receiver Path Interface Impedance Matching Network Examples Outline Dimensions Ordering Guide