Datasheet LTM4675 (Analog Devices) - 130
| 制造商 | Analog Devices |
| 描述 | Dual 9A or Single 18A μModule Regulator with Digital Power System Management |
| 页数 / 页 | 132 / 130 — PACKAGE DESCRIPTION. 3.51mm). NOTES. MAX. 11.9mm. BGA Package. … |
| 修订版 | C |
| 文件格式/大小 | PDF / 4.3 Mb |
| 文件语言 | 英语 |
PACKAGE DESCRIPTION. 3.51mm). NOTES. MAX. 11.9mm. BGA Package. DIMENSIONS. NOM. MIN. 108-Lead (16mm. SYMBOL
该数据表的模型线
文件文字版本
LTM4675
PACKAGE DESCRIPTION
6 3 0517 REV B SEE NOTES PIN 1 SEE NOTES Y BGA 108 A B C D E F G H J K L M AR ACKAGE TED. Y V 1 AIL A 2 ATION DET TIONAL, 3 e 4 TOM VIEW 5 G Y BE EITHER A MOLD OR TING PLANE Y Y LOADING ORIENT 6 TED WITHIN THE ZONE INDICA 7 b PACKAGE BOT TION PER JESD MS-028 AND JEP95 LTMXXXXXX µModule TURE 8 TUM -Z- IS SEA YOUT CAREFULL PACKAGE IN TRA 9 Y DA PACKAGE ROW AND COLUMN LABELING MA AMONG µModule PRODUCTS. REVIEW EACH P LA AILS OF PIN #1 IDENTIFIER ARE OP
!
b e LL DIMENSIONS ARE IN MILLIMETERS DET BUT MUST BE LOCA THE PIN #1 IDENTIFIER MA MARKED FEA F NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994 2. A 3 BALL DESIGNA 4 5. PRIMAR 6 Y PIN 1 BEVEL PIN “A1” TRA COMPONENT Z TE THK ×
3.51mm)
A A2 AIL B
NOTES
BALL HT BALL DIMENSION PAD DIMENSION SUBSTRA MOLD CAP HT DET PACKAGE SIDE VIEW
MAX
3.71 0.70 3.01 0.90 0.66 0.46 2.55 0.15 0.10 0.20 0.30 0.15 ×
11.9mm
Z TE Y X
BGA Package
H1 Z Z
DIMENSIONS NOM
3.51 0.60 2.91 0.75 0.63 16.00 11.90 1.27 13.97 10.16 0.41 2.50 TC DWG # 05-08-1931 Rev B) A1 SUBSTRA M M AL NUMBER OF BALLS: 108 ddd eee b1 TOT AIL A
MIN
3.31 0.50 2.81 0.60 0.60 0.36 2.45 AIL B H2 DET ccc Z DET MOLD CAP
108-Lead (16mm
(Reference L // bbb Z A A1 A2 b b1 D E e F G H1 H2 aaa Øb (108 PLACES) bbb ccc ddd eee
SYMBOL
aaa Z 0.0000 D X Y 6.9850 5.7150 4.4450 3.1750 1.9050 0.6350 0.6350 1.9050 3.1750 4.4450 5.7150 6.9850 5.080 3.810 2.540 YOUT 1.270 E 0.000 1.270 TOP VIEW PACKAGE TOP VIEW 2.540 SUGGESTED PCB LA 3.810 5.080 aaa Z 4 PIN “A1” CORNER 0.630 ±0.025 Ø 108x Rev. C 130 For more information www.analog.com Document Outline Features Applications Typical Application Description Absolute Maximum Ratings Order Information Pin Configuration Electrical Characteristics Typical Performance Characteristics Pin Functions Simplified Block Diagram Decoupling Requirements Functional Diagram Test Circuits Operation Power Module Introduction Power Module Configurability and Readback Data Time-Averaged and Peak Readback Data Power Module Overview EEPROM Serial Interface Device Addressing Fault Detection and Handling Responses to VOUT and IOUT Faults Responses to Timing Faults Responses to SVIN OV Faults Responses to OT/UT Faults Responses to External Faults Fault Logging Bus Timeout Protection PMBus Command Summary PMBus Commands Applications Information VIN to VOUT Step-Down Ratios Input Capacitors Output Capacitors Light Load Current Operation Switching Frequency and Phase Minimum On-Time Considerations Variable Delay Time, Soft-Start and Output Voltage Ramping Digital Servo Mode Soft Off (Sequenced Off) Undervoltage Lockout Fault Detection and Handling Open-Drain Pins Phase-Locked Loop and Frequency Synchronization RCONFIG Pin-Straps (External Resistor Configuration Pins) Voltage Selection Connecting the USB to the I2C/SMBus/PMBus Controller to the LTM4675 In System LTpowerPlay: An Interactive GUI for Digital Power System Management PMBus Communication and Command Processing Thermal Considerations and Output Current Derating EMI Performance Safety Considerations Layout Checklist/Example Typical Applications Appendix A Similarity Between PMBus, SMBus and I2C 2-Wire Interface Appendix B PMBus Serial Digital Interface Appendix C: PMBus Command Details Addressing and Write Protect General Configuration Registers On/Off/Margin PWM Config Voltage Current Temperature Timing Fault Response Fault Sharing Scratchpad Identification Fault Warning and Status Telemetry NVM (EEPROM) Memory Commands Package Description Package Photograph Package Description Revision History Typical Application Design Resources Related Parts
PACKAGE DESCRIPTION
6 3 0517 REV B SEE NOTES PIN 1 SEE NOTES Y BGA 108 A B C D E F G H J K L M AR ACKAGE TED. Y V 1 AIL A 2 ATION DET TIONAL, 3 e 4 TOM VIEW 5 G Y BE EITHER A MOLD OR TING PLANE Y Y LOADING ORIENT 6 TED WITHIN THE ZONE INDICA 7 b PACKAGE BOT TION PER JESD MS-028 AND JEP95 LTMXXXXXX µModule TURE 8 TUM -Z- IS SEA YOUT CAREFULL PACKAGE IN TRA 9 Y DA PACKAGE ROW AND COLUMN LABELING MA AMONG µModule PRODUCTS. REVIEW EACH P LA AILS OF PIN #1 IDENTIFIER ARE OP
!
b e LL DIMENSIONS ARE IN MILLIMETERS DET BUT MUST BE LOCA THE PIN #1 IDENTIFIER MA MARKED FEA F NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994 2. A 3 BALL DESIGNA 4 5. PRIMAR 6 Y PIN 1 BEVEL PIN “A1” TRA COMPONENT Z TE THK ×
3.51mm)
A A2 AIL B
NOTES
BALL HT BALL DIMENSION PAD DIMENSION SUBSTRA MOLD CAP HT DET PACKAGE SIDE VIEW
MAX
3.71 0.70 3.01 0.90 0.66 0.46 2.55 0.15 0.10 0.20 0.30 0.15 ×
11.9mm
Z TE Y X
BGA Package
H1 Z Z
DIMENSIONS NOM
3.51 0.60 2.91 0.75 0.63 16.00 11.90 1.27 13.97 10.16 0.41 2.50 TC DWG # 05-08-1931 Rev B) A1 SUBSTRA M M AL NUMBER OF BALLS: 108 ddd eee b1 TOT AIL A
MIN
3.31 0.50 2.81 0.60 0.60 0.36 2.45 AIL B H2 DET ccc Z DET MOLD CAP
108-Lead (16mm
(Reference L // bbb Z A A1 A2 b b1 D E e F G H1 H2 aaa Øb (108 PLACES) bbb ccc ddd eee
SYMBOL
aaa Z 0.0000 D X Y 6.9850 5.7150 4.4450 3.1750 1.9050 0.6350 0.6350 1.9050 3.1750 4.4450 5.7150 6.9850 5.080 3.810 2.540 YOUT 1.270 E 0.000 1.270 TOP VIEW PACKAGE TOP VIEW 2.540 SUGGESTED PCB LA 3.810 5.080 aaa Z 4 PIN “A1” CORNER 0.630 ±0.025 Ø 108x Rev. C 130 For more information www.analog.com Document Outline Features Applications Typical Application Description Absolute Maximum Ratings Order Information Pin Configuration Electrical Characteristics Typical Performance Characteristics Pin Functions Simplified Block Diagram Decoupling Requirements Functional Diagram Test Circuits Operation Power Module Introduction Power Module Configurability and Readback Data Time-Averaged and Peak Readback Data Power Module Overview EEPROM Serial Interface Device Addressing Fault Detection and Handling Responses to VOUT and IOUT Faults Responses to Timing Faults Responses to SVIN OV Faults Responses to OT/UT Faults Responses to External Faults Fault Logging Bus Timeout Protection PMBus Command Summary PMBus Commands Applications Information VIN to VOUT Step-Down Ratios Input Capacitors Output Capacitors Light Load Current Operation Switching Frequency and Phase Minimum On-Time Considerations Variable Delay Time, Soft-Start and Output Voltage Ramping Digital Servo Mode Soft Off (Sequenced Off) Undervoltage Lockout Fault Detection and Handling Open-Drain Pins Phase-Locked Loop and Frequency Synchronization RCONFIG Pin-Straps (External Resistor Configuration Pins) Voltage Selection Connecting the USB to the I2C/SMBus/PMBus Controller to the LTM4675 In System LTpowerPlay: An Interactive GUI for Digital Power System Management PMBus Communication and Command Processing Thermal Considerations and Output Current Derating EMI Performance Safety Considerations Layout Checklist/Example Typical Applications Appendix A Similarity Between PMBus, SMBus and I2C 2-Wire Interface Appendix B PMBus Serial Digital Interface Appendix C: PMBus Command Details Addressing and Write Protect General Configuration Registers On/Off/Margin PWM Config Voltage Current Temperature Timing Fault Response Fault Sharing Scratchpad Identification Fault Warning and Status Telemetry NVM (EEPROM) Memory Commands Package Description Package Photograph Package Description Revision History Typical Application Design Resources Related Parts