Datasheet HMC365S8G, 365S8GE (Analog Devices) - 4
| 制造商 | Analog Devices |
| 描述 | SMT 4 SMT GaAs HBT MMIC DIVIDE-BY-4, DC - 13 GHz |
| 页数 / 页 | 6 / 4 — HMC365S8G / 365S8GE. SMT GaAs HBT MMIC. DIVIDE-BY-4, DC - 13 GHz. Package … |
| 修订版 | E |
| 文件格式/大小 | PDF / 518 Kb |
| 文件语言 | 英语 |
HMC365S8G / 365S8GE. SMT GaAs HBT MMIC. DIVIDE-BY-4, DC - 13 GHz. Package Information. Pin Description. 4 - 4
该数据表的模型线
文件文字版本
HMC365S8G / 365S8GE
v05.1119
SMT GaAs HBT MMIC DIVIDE-BY-4, DC - 13 GHz Package Information
4 Part Number Package Body Material Lead Finish MSL Rating Package Marking [3] HMC365S8G Low Stress Injection Molded Plastic Sn/Pb Solder MSL1 [1] HMC365 XXXX 4 HMC365S8GE RoHS-compliant Low Stress Injection Molded Plastic 100% matte Sn MSL1 [2] HMC365 T XXXX T M HMC365S8GETR RoHS-compliant Low Stress Injection Molded Plastic 100% matte Sn MSL1 [2] HMC365 XXXX M HMC365S8GTR Low Stress Injection Molded Plastic Sn/Pb Solder MSL1 [1] HMC365 XXXX S - S 104631- Eval Board HMC365S8G S - S R [1] Max peak reflow temperature of 235 °C R O [2] Max peak reflow temperature of 260 °C [3] 4-Digit lot number XXXX O T T C C E E T
Pin Description
T E E Pin Number Function Description Interface Schematic S & D 1 OUT Divided output 180° out of phase with pin 3. S & D R R E E ID 2, 6 N/C No connection. These pins must not be grounded. ID IV IV Y D 3 OUT Divided Output. Y D C C N N E E U U Q 4 Vcc Supply voltage 5V ± 0.25V. Q E E R R F F 5 IN RF Input must be DC blocked. RF Input 180° out of phase with pin 5 for differential operation. 7 IN A/C ground for single ended operation Ground Backside of package has exposed metal ground paddle which 8 GND must be connected to ground. For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 781-329-4700 • Order online at www.analog.com
4 - 4
Application Support: Phone: 1-800-ANALOG-D
v05.1119
SMT GaAs HBT MMIC DIVIDE-BY-4, DC - 13 GHz Package Information
4 Part Number Package Body Material Lead Finish MSL Rating Package Marking [3] HMC365S8G Low Stress Injection Molded Plastic Sn/Pb Solder MSL1 [1] HMC365 XXXX 4 HMC365S8GE RoHS-compliant Low Stress Injection Molded Plastic 100% matte Sn MSL1 [2] HMC365 T XXXX T M HMC365S8GETR RoHS-compliant Low Stress Injection Molded Plastic 100% matte Sn MSL1 [2] HMC365 XXXX M HMC365S8GTR Low Stress Injection Molded Plastic Sn/Pb Solder MSL1 [1] HMC365 XXXX S - S 104631- Eval Board HMC365S8G S - S R [1] Max peak reflow temperature of 235 °C R O [2] Max peak reflow temperature of 260 °C [3] 4-Digit lot number XXXX O T T C C E E T
Pin Description
T E E Pin Number Function Description Interface Schematic S & D 1 OUT Divided output 180° out of phase with pin 3. S & D R R E E ID 2, 6 N/C No connection. These pins must not be grounded. ID IV IV Y D 3 OUT Divided Output. Y D C C N N E E U U Q 4 Vcc Supply voltage 5V ± 0.25V. Q E E R R F F 5 IN RF Input must be DC blocked. RF Input 180° out of phase with pin 5 for differential operation. 7 IN A/C ground for single ended operation Ground Backside of package has exposed metal ground paddle which 8 GND must be connected to ground. For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 781-329-4700 • Order online at www.analog.com
4 - 4
Application Support: Phone: 1-800-ANALOG-D