Datasheet GW1NRF (GOWIN Semiconductor) - 9

制造商GOWIN Semiconductor
描述Series of Bluetooth FPGA Products
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link to page 68 link to page 69 link to page 69 link to page 70 link to page 71 link to page 72 link to page 73 link to page 74 link to page 74 link to page 74 link to page 75 link to page 75 link to page 76 link to page 76 link to page 79 link to page 80 link to page 81 link to page 82 List of Tables Table 4-12 High Frequency Crystal Oscillator Specifications .. 59 Table 4-13 General RF Characteristics .. 60 Table 4-14 Transmitter Characteristics .. 60 Table 4-15 Receiver Characteristics .. 61 Table 4-16 I/O Operating Conditions Recommended .. 62 Table 4-17 IOB Single‐Ended DC Electrical Characteristic ... 63 Table 4-18 IOB Differential Electrical Characteristics .. 64 Table 4-19 CFU Block Internal Timing Parameters .. 65 Table 4-20 B-SRAM Internal Timing Parameters ... 65 Table 4-21 DSP Internal Timing Parameters ... 65 Table 4-22 External Switching Characteristics ... 66 Table 4-23 On chip Oscillator Output Frequency ... 66 Table 4-24 User Flash DC Characteristics ... 67 Table 4-25 User Flash Timing Parameters .. 67 Table 4-26 JTAG Timing Parameters ... 70 Table 4-27 Parameters for Power Recycle and RECONFIG_N Trigger Timing .. 71 Table 4-28 SSPI Timing parameters .. 72 Table 4-29 MSPI Timing Parameters ... 73 DS891-1.0E vi Document Outline Disclaimer Revision History Contents List of Figures List of Tables 1 About This Guide 1.1 Purpose 1.2 Supported Products 1.3 Related Documents 1.4 Abbreviations and Terminology 1.5 Support and Feedback 2 General Description 2.1 Features 2.2 Product Resources 2.3 Package Information 3 Architecture 3.1 Architecture Overview 3.2 SoC System FPU Memories Security Peripherals 3.2.1 Bluetooth Module Bluetooth Controller Mode Bluetooth Companion Mode Bluetooth Application Mode 3.2.2 Timers 3.2.3 Power Management DC DC Switching Power Supply Supply Monitoring 3.2.4 RF Description 3.2.5 Operating Modes 3.2.6 Software Development 3.3 Configurable Function Unit 3.3.1 CLU Register 3.3.2 CRU 3.4 IOB 3.4.1 I/O Buffer 3.4.2 True LVDS Design 3.4.3 I/O Logic IODELAY I/O Register IEM De-serializer DES and Clock Domain Transfer Serializer SER 3.4.4 I/O Logic Modes Basic Mode SDR Mode Generic DDR Mode IDES4 OSER4 Mode IVideo Mode OVideo Mode IDES8 Mode OSER8 Mode IDES10 Mode OSER10 Mode 3.5 Block SRAM (B-SRAM) 3.5.1 Introduction 3.5.2 Configuration Mode 3.5.3 Mixed Data Bus Width Configuration 3.5.4 Byte-enable 3.5.5 Parity Bit 3.5.6 Synchronous operation 3.5.7 Power up Conditions 3.5.8 Operation Modes Single Port Mode Dual Port Mode Semi-Dual Port Mode Read Only 3.5.9 B-SRAM Operation Modes Read Mode Pipeline Mode Bypass Mode Write Mode 3.5.10 Clock Operations Independent Clock Mode Read/Write Clock Operation Single Port Clock Mode 3.6 User Flash 3.6.1 Introduction 3.6.2 User Flash Ports 3.6.3 User Flash Mode Truth Table User Modes 3.7 DSP 3.7.1 Introduction Macro PADD MULT ALU 3.7.2 DSP Operations 3.8 Clock 3.8.1 Global Clock 3.8.2 PLL 3.8.3 HCLK 3.8.4 DLL 3.9 Long Wire (LW) 3.10 Global Set/Reset (GSR) 3.11 Programming Configuration 3.11.1 SRAM Configuration 3.11.2 Flash Configuration 3.12 On Chip Oscillator 4 AC/DC Characteristics 4.1 Operating Conditions 4.2 ESD 4.3 DC Characteristics 4.3.1 Static Current 4.3.2 RF Parameters 4.3.3 I/O Characteristics 4.4 Switching Characteristics 4.4.1 Internal Switching Characteristics 4.4.2 External Switching Characteristics 4.5 User Flash Characteristics 4.5.1 DC Characteristics1 4.5.2 Timing Parameters1,5,6 4.5.3 Operation Timing Diagrams 4.6 Configuration Interface Timing Specification 4.6.1 JTAG Port Timing Specifications 4.6.2 AUTO BOOT Port Timing Specifications 4.6.3 SSPI Port Timing Specifications 4.6.4 MSPI Port Timing Specifications 4.6.5 DUAL BOOT 4.6.6 CPU 4.6.7 SERIAL 5 Ordering Information 5.1 Part Name 5.2 Package Mark