Datasheet BCV61 (Nexperia) - 14
| 制造商 | Nexperia |
| 描述 | NPN general-purpose double transistors |
| 页数 / 页 | 14 / 14 — NXP Semiconductors. BCV61. NPN general-purpose double transistors. 15. … |
| 修订版 | 21012010 |
| 文件格式/大小 | PDF / 262 Kb |
| 文件语言 | 英语 |
NXP Semiconductors. BCV61. NPN general-purpose double transistors. 15. Contents. Product profile . 1. Pinning information . 1
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NXP Semiconductors BCV61 NPN general-purpose double transistors 15. Contents 1 Product profile . 1
1.1 General description . 1 1.2 Features . 1 1.3 Applications . 1
2 Pinning information . 1 3 Ordering information . 2 4 Marking . 2 5 Limiting values. 2 6 Thermal characteristics . 3 7 Characteristics . 3 8 Test information . 8 9 Package outline . 9 10 Packing information . 9 11 Soldering . 10 12 Revision history . 11 13 Legal information. 12
13.1 Data sheet status . 12 13.2 Definitions . 12 13.3 Disclaimers . 12 13.4 Trademarks. 12
14 Contact information. 12 15 Contents . 13
Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’.
© NXP B.V. 2009. All rights reserved.
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 18 December 2009 Document identifier: BCV61_4
Document Outline 1. Product profile 1.1 General description 1.2 Features 1.3 Applications 2. Pinning information 3. Ordering information 4. Marking 5. Limiting values 6. Thermal characteristics 7. Characteristics 8. Test information 9. Package outline 10. Packing information 11. Soldering 12. Revision history 13. Legal information 13.1 Data sheet status 13.2 Definitions 13.3 Disclaimers 13.4 Trademarks 14. Contact information 15. Contents
NXP Semiconductors BCV61 NPN general-purpose double transistors 15. Contents 1 Product profile . 1
1.1 General description . 1 1.2 Features . 1 1.3 Applications . 1
2 Pinning information . 1 3 Ordering information . 2 4 Marking . 2 5 Limiting values. 2 6 Thermal characteristics . 3 7 Characteristics . 3 8 Test information . 8 9 Package outline . 9 10 Packing information . 9 11 Soldering . 10 12 Revision history . 11 13 Legal information. 12
13.1 Data sheet status . 12 13.2 Definitions . 12 13.3 Disclaimers . 12 13.4 Trademarks. 12
14 Contact information. 12 15 Contents . 13
Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’.
© NXP B.V. 2009. All rights reserved.
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 18 December 2009 Document identifier: BCV61_4
Document Outline 1. Product profile 1.1 General description 1.2 Features 1.3 Applications 2. Pinning information 3. Ordering information 4. Marking 5. Limiting values 6. Thermal characteristics 7. Characteristics 8. Test information 9. Package outline 10. Packing information 11. Soldering 12. Revision history 13. Legal information 13.1 Data sheet status 13.2 Definitions 13.3 Disclaimers 13.4 Trademarks 14. Contact information 15. Contents