Datasheet VM3000 (Vesper)

制造商Vesper
描述Low Noise PDM Digital Bottom Port Piezoelectric MEMS Microphone
页数 / 页12 / 1 — VM3000. PRELIMINARY DATASHEET. GENERAL DESCRIPTION. FEATURES. BLOCK …
文件格式/大小PDF / 765 Kb
文件语言英语

VM3000. PRELIMINARY DATASHEET. GENERAL DESCRIPTION. FEATURES. BLOCK DIAGRAM. APPLICATIONS. TYPICAL APPLICATION CIRCUIT

Datasheet VM3000 Vesper

该数据表的模型线

文件文字版本

VM3000
Low Noise PDM Digital Bottom Port Piezoelectric MEMS Microphone
PRELIMINARY DATASHEET GENERAL DESCRIPTION
The VM3000 is a high performance, low noise digital MEMS microphone. It features a PDM output enabling multiplexing of two microphones on a single data line. The digital output has high immunity to RFI and EMI providing designers with more flexibility in the position of the mics and the routing of their wires in system. The VM3000 has an industry standard 3.5x2.65x1.3mm package. The microphone is solder reflow compatible with no sensitivity degradation. It operates in environmentally harsh surroundings being dust and moisture resistant.
FEATURES
• Digital Output, Pulse Density Modulation (PDM)
BLOCK DIAGRAM
• Dust and moisture resistant, IP57 • Ultra-fast startup • RFI and EMI robust • Industry standard 3.5 x 2.65mm LGA package footprint
APPLICATIONS
• Beamforming Arrays

• Smart Home Devices

• Outdoor Applications Functional Block Diagram • Wearables

• IP Security Cameras
TYPICAL APPLICATION CIRCUIT ORDERING INFORMATION Product Package Description Quantity
VM3000 13” Tape and Reel 5,000 Typical Application Circuit Document Name: VM3000_Datasheet Page 1 of 12 Vesper reserves the right to alter the datasheet specifications Revision: U0.0.0 without notification. Vesper assumes no liability for the use of engineering samples and offers no warranty for this product. info@vespermems.com Document Outline GENERAL DESCRIPTION FEATURES APPLICATIONS ORDERING INFORMATION BLOCK DIAGRAM TYPICAL APPLICATION CIRCUIT TABLE OF CONTENTS SPECIFICATIONS PDM DIGITAL SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS ENVIRONMENTAL ROBUSTNESS RELIABILITY SPECIFCATIONS MICROPHONE OPERATION MICROPHONE MODES TIMING SPECIFICATIONS TYPICAL PERFORMANCE CHARACTERISTICS SOLDER REFLOW PROFILE HANDLING INSTRUCTIONS DIMENSIONS AND PIN LAYOUT PCB DESIGN AND LAND PATTERN LAYOUT TAPE AND REEL SPECIFICATIONS LID MARKING SUPPORTING DOCUMENTS COMPLIANCE INFORMATION CONTACT DETAILS LEGAL INFORMATION REVISION HISTORY