Datasheet AD7924-KGD (Analog Devices) - 8
| 制造商 | Analog Devices |
| 描述 | 4-Channel, 1 MSPS, 12-Bit A/D Converter with Sequencer in 16-Lead TSSOP |
| 页数 / 页 | 8 / 8 — AD7924-KGD. Known Good Die. OUTLINE DIMENSIONS. 0.500. 2.300. 23 22. … |
| 修订版 | A |
| 文件格式/大小 | PDF / 220 Kb |
| 文件语言 | 英语 |
AD7924-KGD. Known Good Die. OUTLINE DIMENSIONS. 0.500. 2.300. 23 22. 2.620. 8 9 10 11 12 13 14 15. TOP VIEW. SIDE VIEW. (CIRCUIT SIDE)
该数据表的模型线
文件文字版本
AD7924-KGD Known Good Die OUTLINE DIMENSIONS 0.500 2.300 24 1 23 22 2 21 3 20 4 19 2.620 5 18 6 17 7 16 8 9 10 11 12 13 14 15 TOP VIEW SIDE VIEW (CIRCUIT SIDE) A 0.092 × 0.092 11- 20 12- 09-
Figure 4. 24-Pad Bare Die [CHIP] (C-24-1) Dimensions shown in millimeters
DIE SPECIFICATIONS AND ASSEMBLY RECOMMENDATIONS Table 5. Die Specifications Parameter Value Unit
Chip Size 2180 (x) × 2450 (y) µm Scribe Line Width 120 (x) × 170 (y) µm Die Size 2300 (x) × 2620 (y) µm Thickness 500 µm Backside Silicon Not applicable Passivation Nitride Not applicable Bond Pads (Minimum) 92 × 92 µm Bond Pad Composition 99.5% Al, 0.5% Cu % ESD 1.5 kV
Table 6. Assembly Recommendations Assembly Component Recommendation
Die Attach No special recommendations Bonding Method Gold ball or aluminum wedge Bonding Sequence 9 and 10
ORDERING GUIDE Model Temperature Range Package Description Package Option
AD7924-KGD-DF −40°C to +85°C 24-Pad Bare Die [CHIP] C-24-1
©2011–2014 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D10106-0-11/14(A)
Rev. A | Page 8 of 8 Document Outline FEATURES GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM PRODUCT HIGHLIGHTS TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS TIMING SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS OUTLINE DIMENSIONS DIE SPECIFICATIONS AND ASSEMBLY RECOMMENDATIONS ORDERING GUIDE
Figure 4. 24-Pad Bare Die [CHIP] (C-24-1) Dimensions shown in millimeters
DIE SPECIFICATIONS AND ASSEMBLY RECOMMENDATIONS Table 5. Die Specifications Parameter Value Unit
Chip Size 2180 (x) × 2450 (y) µm Scribe Line Width 120 (x) × 170 (y) µm Die Size 2300 (x) × 2620 (y) µm Thickness 500 µm Backside Silicon Not applicable Passivation Nitride Not applicable Bond Pads (Minimum) 92 × 92 µm Bond Pad Composition 99.5% Al, 0.5% Cu % ESD 1.5 kV
Table 6. Assembly Recommendations Assembly Component Recommendation
Die Attach No special recommendations Bonding Method Gold ball or aluminum wedge Bonding Sequence 9 and 10
ORDERING GUIDE Model Temperature Range Package Description Package Option
AD7924-KGD-DF −40°C to +85°C 24-Pad Bare Die [CHIP] C-24-1
©2011–2014 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D10106-0-11/14(A)
Rev. A | Page 8 of 8 Document Outline FEATURES GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM PRODUCT HIGHLIGHTS TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS TIMING SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS OUTLINE DIMENSIONS DIE SPECIFICATIONS AND ASSEMBLY RECOMMENDATIONS ORDERING GUIDE