Datasheet DPS368 (Infineon) - 42

DPS368 Reflow soldering and board assembly Table 19 Reflow profile limits Profile feature Pb-Free assembly Sn-Pb Eutectic assembly
Preheat/Soak Temperature Min (Tsmin) 150 °C 100 °C Temperature Max (Tsmax) 200 °C 150 °C Time (Tsmin to Tsmax) (ts) 60-120 seconds 60-150 seconds Peak Temperature (Tp) 260°C +0°C/-5°C 235°C +0°C/-5°C Time within 5°C of actual peak 20-40 seconds 10-30 seconds temperature (tp)* Ramp-down rate 6 °C/second max. 6 °C/second max. Time 25°C to peak temperature 8 minutes max. 6 minutes max. * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum Note: For further information please consult the 'General recommendation for assembly of Infineon packages' document which is available on the Infineon Technologies web page The Infineon pressure sensors can be handled using industry standard pick and place equipment. Care should be taken to avoid damage to the sensor structure as follows: • Do not pick the sensor with vacuum tools which make contact with the sensor vent port hole • The sensor's vent hole should not be exposed to vacuum, this can destroy or damage the MEMS • Do not blow air into the sensor vent hole. If an air blow cleaning process is used, the vent hole must be sealed to prevent particle contamination. • It is recommended to perform the PCB assembly in a clean room environment in order to avoid sensor contamination. Preliminary datasheet 42 v1.0 2019-03-14 Document Outline Product Description Features Typical applications Product Validation Table of contents 1 Definitions, acronyms and abbreviations 1.1 Definitions 2 Pin Configuration and Block Diagram 2.1 Pin Configuration and Description 2.2 Block Diagram 3 Specifications 3.1 Operating Range 3.2 Absolute Maximum Ratings 3.3 Current Consumption 3.4 Temperature Transfer Function 3.5 Pressure Transfer Function 3.6 Timing Characteristics 4 Functional Description 4.1 Operating Modes 4.2 Mode transition diagram 4.3 Start-up sequence 4.4 Measurement Precision and Rate 4.5 Sensor Interface 4.6 Interrupt 4.7 Result Register Operation 4.8 FIFO Operation 4.9 Calibration and Measurement Compensation 4.9.1 How to Calculate Compensated Pressure Values 4.9.2 How to Calculate Compensated Temperature Values 4.9.3 Compensation Scale Factors 4.9.4 Pressure and Temperature calculation flow 5 Applications 5.1 Measurement Settings and Use Case Examples 5.2 Application Circuit Example 5.3 IIR filtering 6 Digital interfaces 6.1 I2C Interface 6.2 SPI Interface 6.3 Interface parameters specification 6.3.1 General interface parameters 6.3.1.1 I2C timings 6.3.1.2 SPI timings 7 Register Map 8 Register description 8.1 Pressure Data (PRS_Bn) 8.1.1 PRS_B2 8.1.2 PRS_B1 8.1.3 PRS_B0 8.2 Temperature Data (TMP_Tn) 8.2.1 TMP_B2 8.2.2 TMP_B1 8.2.3 TMP_B0 8.3 Pressure Configuration (PRS_CFG) 8.4 Temperature Configuration(TMP_CFG) 8.5 Sensor Operating Mode and Status (MEAS_CFG) 8.6 Interrupt and FIFO configuration (CFG_REG) 8.7 Interrupt Status (INT_STS) 8.8 FIFO Status (FIFO_STS) 8.9 Soft Reset and FIFO flush (RESET) 8.10 Product and Revision ID (ID) 8.11 Calibration Coefficients (COEF) 8.12 Coefficient Source 9 Package Dimensions 9.1 Package drawing 10 Footprint and stencil recommendation 11 Reflow soldering and board assembly 12 Package Handling Revision history Disclaimer