Datasheet LT3742 (Analog Devices) - 24
| 制造商 | Analog Devices |
| 描述 | Dual, 2-Phase Step-Down Switching Controller |
| 页数 / 页 | 26 / 24 — package DescripTion. UF Package. 24-Lead Plastic QFN (4mm. 4mm) |
| 文件格式/大小 | PDF / 319 Kb |
| 文件语言 | 英语 |
package DescripTion. UF Package. 24-Lead Plastic QFN (4mm. 4mm)
该数据表的模型线
文件文字版本
LT3742
package DescripTion UF Package 24-Lead Plastic QFN (4mm
×
4mm)
(Reference LTC DWG # 05-08-1697) 0.70 ±0.05 4.50 ± 0.05 2.45 ± 0.05 3.10 ± 0.05 (4 SIDES) PACKAGE OUTLINE 0.25 ±0.05 0.50 BSC RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS BOTTOM VIEW—EXPOSED PAD PIN 1 NOTCH R = 0.20 TYP OR 4.00 ± 0.10 0.75 ± 0.05 R = 0.115 0.35 × 45° CHAMFER (4 SIDES) TYP 23 24 PIN 1 0.40 ± 0.10 TOP MARK (NOTE 6) 1 2 2.45 ± 0.10 (4-SIDES) (UF24) QFN 0105 0.200 REF 0.25 ± 0.05 0.00 – 0.05 0.50 BSC NOTE: 1. DRAWING PROPOSED TO BE MADE A JEDEC PACKAGE OUTLINE MO-220 VARIATION (WGGD-X)—TO BE APPROVED 2. DRAWING NOT TO SCALE 3. ALL DIMENSIONS ARE IN MILLIMETERS 4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE, IF PRESENT 5. EXPOSED PAD SHALL BE SOLDER PLATED 6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE 3742fa 24 Document Outline Features Applications Description Typical Application Absolute Maximum Ratings Pin Configuration Order Information Electrical Characteristics Typical Performance Characteristics Pin Functions Block Diagram Operation Applications Information Typical Applications Package Description Revision History Related Parts
package DescripTion UF Package 24-Lead Plastic QFN (4mm
×
4mm)
(Reference LTC DWG # 05-08-1697) 0.70 ±0.05 4.50 ± 0.05 2.45 ± 0.05 3.10 ± 0.05 (4 SIDES) PACKAGE OUTLINE 0.25 ±0.05 0.50 BSC RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS BOTTOM VIEW—EXPOSED PAD PIN 1 NOTCH R = 0.20 TYP OR 4.00 ± 0.10 0.75 ± 0.05 R = 0.115 0.35 × 45° CHAMFER (4 SIDES) TYP 23 24 PIN 1 0.40 ± 0.10 TOP MARK (NOTE 6) 1 2 2.45 ± 0.10 (4-SIDES) (UF24) QFN 0105 0.200 REF 0.25 ± 0.05 0.00 – 0.05 0.50 BSC NOTE: 1. DRAWING PROPOSED TO BE MADE A JEDEC PACKAGE OUTLINE MO-220 VARIATION (WGGD-X)—TO BE APPROVED 2. DRAWING NOT TO SCALE 3. ALL DIMENSIONS ARE IN MILLIMETERS 4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE, IF PRESENT 5. EXPOSED PAD SHALL BE SOLDER PLATED 6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE 3742fa 24 Document Outline Features Applications Description Typical Application Absolute Maximum Ratings Pin Configuration Order Information Electrical Characteristics Typical Performance Characteristics Pin Functions Block Diagram Operation Applications Information Typical Applications Package Description Revision History Related Parts