Datasheet LT3686A (Analog Devices) - 28
| 制造商 | Analog Devices |
| 描述 | 37V/1.2A Step-Down Regulator in 3mm × 3mm DFN and MSE |
| 页数 / 页 | 30 / 28 — pAckAGe Description. DD Package. 10-Lead Plastic DFN (3mm. 3mm). … |
| 文件格式/大小 | PDF / 522 Kb |
| 文件语言 | 英语 |
pAckAGe Description. DD Package. 10-Lead Plastic DFN (3mm. 3mm). RECOMMENDED
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LT3686A
pAckAGe Description DD Package DD Package 10-Lead Plastic DFN (3mm 10-Lead Plastic DFN (3mm
×
3mm)
×
3mm)
(Reference LTC DWG # 05-08-1699 Rev C) (Reference LTC DWG # 05-08-1699 Rev C) 0.70 ±0.05 3.55 ±0.05 1.65 ±0.05 2.15 ±0.05 (2 SIDES) PACKAGE OUTLINE 0.25 ± 0.05 0.50 BSC 2.38 ±0.05 (2 SIDES)
RECOMMENDED
SOLDER PAD PITCH AND DIMENSIONS R = 0.125 0.40 ± 0.10 TYP 6 10 3.00 ±0.10 1.65 ± 0.10 (4 SIDES) (2 SIDES) PIN 1 NOTCH PIN 1 R = 0.20 OR TOP MARK 0.35 × 45° (SEE NOTE 6) CHAMFER (DD) DFN REV C 0310 5 1 0.200 REF 0.75 ±0.05 0.25 ± 0.05 0.50 BSC 2.38 ±0.10 (2 SIDES) 0.00 – 0.05 BOTTOM VIEW—EXPOSED PAD NOTE: 1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-2). CHECK THE LTC WEBSITE DATA SHEET FOR CURRENT STATUS OF VARIATION ASSIGNMENT 2. DRAWING NOT TO SCALE 3. ALL DIMENSIONS ARE IN MILLIMETERS 4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE 5. EXPOSED PAD SHALL BE SOLDER PLATED 6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE 3686afa 28 Document Outline Features Description Applications Typical Application Absolute Maximum Ratings Pin Configuration Order Information Electrical Characteristics Typical Performance Characteristics Pin Functions Block Diagram Operation Applications Information Typical Applications Package Description Revision History Typical Application Related Parts
pAckAGe Description DD Package DD Package 10-Lead Plastic DFN (3mm 10-Lead Plastic DFN (3mm
×
3mm)
×
3mm)
(Reference LTC DWG # 05-08-1699 Rev C) (Reference LTC DWG # 05-08-1699 Rev C) 0.70 ±0.05 3.55 ±0.05 1.65 ±0.05 2.15 ±0.05 (2 SIDES) PACKAGE OUTLINE 0.25 ± 0.05 0.50 BSC 2.38 ±0.05 (2 SIDES)
RECOMMENDED
SOLDER PAD PITCH AND DIMENSIONS R = 0.125 0.40 ± 0.10 TYP 6 10 3.00 ±0.10 1.65 ± 0.10 (4 SIDES) (2 SIDES) PIN 1 NOTCH PIN 1 R = 0.20 OR TOP MARK 0.35 × 45° (SEE NOTE 6) CHAMFER (DD) DFN REV C 0310 5 1 0.200 REF 0.75 ±0.05 0.25 ± 0.05 0.50 BSC 2.38 ±0.10 (2 SIDES) 0.00 – 0.05 BOTTOM VIEW—EXPOSED PAD NOTE: 1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-2). CHECK THE LTC WEBSITE DATA SHEET FOR CURRENT STATUS OF VARIATION ASSIGNMENT 2. DRAWING NOT TO SCALE 3. ALL DIMENSIONS ARE IN MILLIMETERS 4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE 5. EXPOSED PAD SHALL BE SOLDER PLATED 6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE 3686afa 28 Document Outline Features Description Applications Typical Application Absolute Maximum Ratings Pin Configuration Order Information Electrical Characteristics Typical Performance Characteristics Pin Functions Block Diagram Operation Applications Information Typical Applications Package Description Revision History Typical Application Related Parts