Datasheet LT1636 (Analog Devices) - 14
| 制造商 | Analog Devices |
| 描述 | Over-The-Top Micropower Rail-to-Rail Input and Output Op Amp |
| 页数 / 页 | 16 / 14 — PACKAGE DESCRIPTION. DD Package. 8-Lead Plastic DFN (3mm. 3mm). MS8 … |
| 文件格式/大小 | PDF / 403 Kb |
| 文件语言 | 英语 |
PACKAGE DESCRIPTION. DD Package. 8-Lead Plastic DFN (3mm. 3mm). MS8 Package. 8-Lead Plastic MSOP
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文件文字版本
LT1636
U PACKAGE DESCRIPTION DD Package 8-Lead Plastic DFN (3mm
×
3mm)
(Reference LTC DWG # 05-08-1698) R = 0.115 0.38 ± 0.10 TYP 5 8 0.675 ±0.05 3.5 ±0.05 1.65 ±0.05 3.00 ±0.10 1.65 ± 0.10 2.15 ±0.05 (2 SIDES) (4 SIDES) (2 SIDES) PIN 1 TOP MARK PACKAGE OUTLINE (DD8) DFN 0203 4 1 0.28 ± 0.05 0.200 REF 0.75 ±0.05 0.28 ± 0.05 0.50 0.50 BSC BSC 2.38 ±0.10 (2 SIDES) 2.38 ±0.05 0.00 – 0.05 (2 SIDES) BOTTOM VIEW—EXPOSED PAD RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS NOTE: 1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-1) 2. ALL DIMENSIONS ARE IN MILLIMETERS 3. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE 4. EXPOSED PAD SHALL BE SOLDER PLATED
MS8 Package 8-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1660) 0.889 ± 0.127 (.035 ± .005) 5.23 (.206) 3.2 – 3.45 MIN (.126 – .136) 3.00 ± 0.102 (.118 0.42 ± 0.04 0.65 ± .004) 0.52 (.0165 ± .0015) (.0256) (NOTE 3) 8 7 6 5 (.206) TYP BSC REF RECOMMENDED SOLDER PAD LAYOUT 3.00 ± 0.102 4.90 ± 0.15 DETAIL “A” (.118 ± .004) 0.254 (1.93 ± .006) NOTE 4 (.010) 0° – 6° TYP GAUGE PLANE 1 2 3 4 0.53 ± 0.015 (.021 ± .006) 1.10 0.86 (.043) (.034) DETAIL “A” MAX REF 0.18 (.077) SEATING PLANE 0.22 – 0.38 0.13 ± 0.076 (.009 – .015) (.005 ± .003) 0.65 TYP MSOP (MS8) 0802 (.0256) NOTE: BSC 1. DIMENSIONS IN MILLIMETER/(INCH) 2. DRAWING NOT TO SCALE 3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE 4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS. INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE 5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX 1636fc 14
U PACKAGE DESCRIPTION DD Package 8-Lead Plastic DFN (3mm
×
3mm)
(Reference LTC DWG # 05-08-1698) R = 0.115 0.38 ± 0.10 TYP 5 8 0.675 ±0.05 3.5 ±0.05 1.65 ±0.05 3.00 ±0.10 1.65 ± 0.10 2.15 ±0.05 (2 SIDES) (4 SIDES) (2 SIDES) PIN 1 TOP MARK PACKAGE OUTLINE (DD8) DFN 0203 4 1 0.28 ± 0.05 0.200 REF 0.75 ±0.05 0.28 ± 0.05 0.50 0.50 BSC BSC 2.38 ±0.10 (2 SIDES) 2.38 ±0.05 0.00 – 0.05 (2 SIDES) BOTTOM VIEW—EXPOSED PAD RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS NOTE: 1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-1) 2. ALL DIMENSIONS ARE IN MILLIMETERS 3. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE 4. EXPOSED PAD SHALL BE SOLDER PLATED
MS8 Package 8-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1660) 0.889 ± 0.127 (.035 ± .005) 5.23 (.206) 3.2 – 3.45 MIN (.126 – .136) 3.00 ± 0.102 (.118 0.42 ± 0.04 0.65 ± .004) 0.52 (.0165 ± .0015) (.0256) (NOTE 3) 8 7 6 5 (.206) TYP BSC REF RECOMMENDED SOLDER PAD LAYOUT 3.00 ± 0.102 4.90 ± 0.15 DETAIL “A” (.118 ± .004) 0.254 (1.93 ± .006) NOTE 4 (.010) 0° – 6° TYP GAUGE PLANE 1 2 3 4 0.53 ± 0.015 (.021 ± .006) 1.10 0.86 (.043) (.034) DETAIL “A” MAX REF 0.18 (.077) SEATING PLANE 0.22 – 0.38 0.13 ± 0.076 (.009 – .015) (.005 ± .003) 0.65 TYP MSOP (MS8) 0802 (.0256) NOTE: BSC 1. DIMENSIONS IN MILLIMETER/(INCH) 2. DRAWING NOT TO SCALE 3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE 4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS. INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE 5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX 1636fc 14