Datasheet LT1809, LT1810 (Analog Devices) - 22
| 制造商 | Analog Devices |
| 描述 | Single/Dual 180MHz, 350V/µs Rail-to-Rail Input and Output Low Distortion Op Amps |
| 页数 / 页 | 24 / 22 — PACKAGE DESCRIPTION. S6 Package. 6-Lead Plastic TSOT-23 |
| 文件格式/大小 | PDF / 301 Kb |
| 文件语言 | 英语 |
PACKAGE DESCRIPTION. S6 Package. 6-Lead Plastic TSOT-23
该数据表的模型线
文件文字版本
LT1809/LT1810
PACKAGE DESCRIPTION S6 Package 6-Lead Plastic TSOT-23
(Reference LTC DWG # 05-08-1636 Rev B) 2.90 BSC 0.62 0.95 (NOTE 4) MAX REF 1.22 REF 1.50 – 1.75 2.80 BSC 3.85 MAX 2.62 REF 1.4 MIN (NOTE 4) PIN ONE ID RECOMMENDED SOLDER PAD LAYOUT 0.30 – 0.45 0.95 BSC PER IPC CALCULATOR 6 PLCS (NOTE 3) 0.80 – 0.90 0.20 BSC 0.01 – 0.10 1.00 MAX DATUM ‘A’ 0.30 – 0.50 REF 0.09 – 0.20 1.90 BSC (NOTE 3) S6 TSOT-23 0302 REV B NOTE: 1. DIMENSIONS ARE IN MILLIMETERS 2. DRAWING NOT TO SCALE 3. DIMENSIONS ARE INCLUSIVE OF PLATING 4. DIMENSIONS ARE EXCLUSIVE OF MOLD FLASH AND METAL BURR 5. MOLD FLASH SHALL NOT EXCEED 0.254mm 6. JEDEC PACKAGE REFERENCE IS MO-193 180910fa 22
PACKAGE DESCRIPTION S6 Package 6-Lead Plastic TSOT-23
(Reference LTC DWG # 05-08-1636 Rev B) 2.90 BSC 0.62 0.95 (NOTE 4) MAX REF 1.22 REF 1.50 – 1.75 2.80 BSC 3.85 MAX 2.62 REF 1.4 MIN (NOTE 4) PIN ONE ID RECOMMENDED SOLDER PAD LAYOUT 0.30 – 0.45 0.95 BSC PER IPC CALCULATOR 6 PLCS (NOTE 3) 0.80 – 0.90 0.20 BSC 0.01 – 0.10 1.00 MAX DATUM ‘A’ 0.30 – 0.50 REF 0.09 – 0.20 1.90 BSC (NOTE 3) S6 TSOT-23 0302 REV B NOTE: 1. DIMENSIONS ARE IN MILLIMETERS 2. DRAWING NOT TO SCALE 3. DIMENSIONS ARE INCLUSIVE OF PLATING 4. DIMENSIONS ARE EXCLUSIVE OF MOLD FLASH AND METAL BURR 5. MOLD FLASH SHALL NOT EXCEED 0.254mm 6. JEDEC PACKAGE REFERENCE IS MO-193 180910fa 22