Datasheet LT1815, LT1816, LT1817 (Analog Devices) - 18
| 制造商 | Analog Devices |
| 描述 | Quad 220MHz, 1500V/µs Operational Amplifiers with Programmable Supply Current |
| 页数 / 页 | 20 / 18 — PACKAGE DESCRIPTION. MS8 Package. 8-Lead Plastic MSOP. MS Package. … |
| 文件格式/大小 | PDF / 556 Kb |
| 文件语言 | 英语 |
PACKAGE DESCRIPTION. MS8 Package. 8-Lead Plastic MSOP. MS Package. 10-Lead Plastic MSOP
该数据表的模型线
- LT1815CS5#PBF LT1815CS5#TRMPBF LT1815CS5#TRPBF LT1815CS6#PBF LT1815CS6#TRMPBF LT1815CS6#TRPBF LT1815CS8#PBF LT1815CS8#TRPBF LT1815IS5#PBF LT1815IS5#TRMPBF LT1815IS5#TRPBF LT1815IS6#PBF LT1815IS6#TRMPBF LT1815IS6#TRPBF LT1815IS8#PBF LT1815IS8#TRPBF
文件文字版本
LT1815/LT1816/LT1817
PACKAGE DESCRIPTION MS8 Package 8-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1660 Rev F) 3.00 p 0.102 (.118 p .004) 0.52 (NOTE 3) 8 7 6 5 (.0205) 0.889 p 0.127 REF (.035 p .005) DETAIL “A” 0.254 3.00 p 0.102 4.90 p 0.152 5.23 (.010) (.118 p .004) 0o – 6o TYP (.193 p .006) (.206) 3.20 – 3.45 (NOTE 4) MIN (.126 – .136) GAUGE PLANE 0.53 p 0.152 1 2 3 4 (.021 p .006) 0.42 p 0.038 0.65 1.10 0.86 (.0165 p .0015) (.0256) (.043) (.034) TYP BSC DETAIL “A” MAX REF RECOMMENDED SOLDER PAD LAYOUT 0.18 (.007) SEATING PLANE 0.22 – 0.38 0.1016 p 0.0508 (.009 – .015) (.004 p .002) TYP 0.65 MSOP (MS8) 0307 REV F (.0256) BSC NOTE: 1. DIMENSIONS IN MILLIMETER/(INCH) 4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS. INTERLEAD 2. DRAWING NOT TO SCALE FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE 3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD 5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE (.004") MAX
MS Package 10-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1661 Rev E) 3.00 ± 0.102 (.118 ± .004) 0.889 ± 0.127 0.497 ± 0.076 (.035 ± .005) (NOTE 3) (.0196 ± .003) 10 9 8 7 6 REF 5.23 3.20 – 3.45 3.00 ± 0.102 (.206) 4.90 ± 0.152 MIN (.126 – .136) DETAIL “A” (.118 ± .004) (.193 ± .006) 0.254 (NOTE 4) (.010) 0° – 6° TYP GAUGE PLANE 0.305 ± 0.038 0.50 (.0120 ± .0015) (.0197) 1 2 3 4 5 TYP BSC 0.53 ± 0.152 RECOMMENDED SOLDER PAD LAYOUT (.021 ± .006) 1.10 0.86 (.043) (.034) DETAIL “A” MAX REF 0.18 (.007) SEATING PLANE 0.17 – 0.27 0.1016 ± 0.0508 (.007 – .011) (.004 ± .002) 0.50 TYP MSOP (MS) 0307 REV E (.0197) BSC NOTE: 1. DIMENSIONS IN MILLIMETER/(INCH) 4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS. 2. DRAWING NOT TO SCALE INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE 3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD 5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE 181567fb 18
PACKAGE DESCRIPTION MS8 Package 8-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1660 Rev F) 3.00 p 0.102 (.118 p .004) 0.52 (NOTE 3) 8 7 6 5 (.0205) 0.889 p 0.127 REF (.035 p .005) DETAIL “A” 0.254 3.00 p 0.102 4.90 p 0.152 5.23 (.010) (.118 p .004) 0o – 6o TYP (.193 p .006) (.206) 3.20 – 3.45 (NOTE 4) MIN (.126 – .136) GAUGE PLANE 0.53 p 0.152 1 2 3 4 (.021 p .006) 0.42 p 0.038 0.65 1.10 0.86 (.0165 p .0015) (.0256) (.043) (.034) TYP BSC DETAIL “A” MAX REF RECOMMENDED SOLDER PAD LAYOUT 0.18 (.007) SEATING PLANE 0.22 – 0.38 0.1016 p 0.0508 (.009 – .015) (.004 p .002) TYP 0.65 MSOP (MS8) 0307 REV F (.0256) BSC NOTE: 1. DIMENSIONS IN MILLIMETER/(INCH) 4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS. INTERLEAD 2. DRAWING NOT TO SCALE FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE 3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD 5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE (.004") MAX
MS Package 10-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1661 Rev E) 3.00 ± 0.102 (.118 ± .004) 0.889 ± 0.127 0.497 ± 0.076 (.035 ± .005) (NOTE 3) (.0196 ± .003) 10 9 8 7 6 REF 5.23 3.20 – 3.45 3.00 ± 0.102 (.206) 4.90 ± 0.152 MIN (.126 – .136) DETAIL “A” (.118 ± .004) (.193 ± .006) 0.254 (NOTE 4) (.010) 0° – 6° TYP GAUGE PLANE 0.305 ± 0.038 0.50 (.0120 ± .0015) (.0197) 1 2 3 4 5 TYP BSC 0.53 ± 0.152 RECOMMENDED SOLDER PAD LAYOUT (.021 ± .006) 1.10 0.86 (.043) (.034) DETAIL “A” MAX REF 0.18 (.007) SEATING PLANE 0.17 – 0.27 0.1016 ± 0.0508 (.007 – .011) (.004 ± .002) 0.50 TYP MSOP (MS) 0307 REV E (.0197) BSC NOTE: 1. DIMENSIONS IN MILLIMETER/(INCH) 4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS. 2. DRAWING NOT TO SCALE INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE 3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD 5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE 181567fb 18