Datasheet LT1722, LT1723, LT1724 (Analog Devices) - 16
| 制造商 | Analog Devices |
| 描述 | Quad 200MHz Low Noise Precision Op Amps |
| 页数 / 页 | 18 / 16 — PACKAGE DESCRIPTION. S8 Package. 8-Lead Plastic Small Outline (Narrow … |
| 文件格式/大小 | PDF / 306 Kb |
| 文件语言 | 英语 |
PACKAGE DESCRIPTION. S8 Package. 8-Lead Plastic Small Outline (Narrow .150 Inch). MS8 Package. 8-Lead Plastic MSOP
该数据表的模型线
- LT1722CS5#PBF LT1722CS5#TRMPBF LT1722CS5#TRPBF LT1722CS8#PBF LT1722CS8#TRPBF LT1722IS5#PBF LT1722IS5#TRMPBF LT1722IS5#TRPBF LT1722IS8#PBF LT1722IS8#TRPBF
文件文字版本
LT1722/LT1723/LT1724
PACKAGE DESCRIPTION S8 Package 8-Lead Plastic Small Outline (Narrow .150 Inch)
(Reference LTC DWG # 05-08-1610) .189 – .197 (4.801 – 5.004) .045 ±.005 NOTE 3 .050 BSC 8 7 6 5 .245 MIN .160 ±.005 .150 – .157 .228 – .244 (3.810 – 3.988) (5.791 – 6.197) NOTE 3 .030 ±.005 TYP 1 2 3 4 RECOMMENDED SOLDER PAD LAYOUT .010 – .020 s 45° .053 – .069 (0.254 – 0.508) (1.346 – 1.752) .004 – .010 .008 – .010 0°– 8° TYP (0.101 – 0.254) (0.203 – 0.254) .016 – .050 .014 – .019 .050 (0.406 – 1.270) (0.355 – 0.483) (1.270) NOTE: TYP BSC INCHES 1. DIMENSIONS IN (MILLIMETERS) 2. DRAWING NOT TO SCALE 3. THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .006" (0.15mm) SO8 0303
MS8 Package 8-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1660 Rev F) 3.00 ± 0.102 0.889 ± 0.127 (.118 ± .004) 0.52 (.035 ± .005) (NOTE 3) 8 7 6 5 (.0205) REF 5.23 3.20 – 3.45 3.00 ± 0.102 (.206) 4.90 ± 0.152 (.126 – .136) DETAIL “A” (.118 ± .004) MIN 0.254 (.193 ± .006) (NOTE 4) (.010) 0° – 6° TYP GAUGE PLANE 0.42 ± 0.038 0.65 (.0165 ± .0015) (.0256) 1 2 3 4 TYP BSC 0.53 ± 0.152 (.021 ± .006) 1.10 0.86 RECOMMENDED SOLDER PAD LAYOUT (.043) (.034) DETAIL “A” MAX REF 0.18 (.007) SEATING PLANE NOTE: 0.22 – 0.38 0.1016 ± 0.0508 1. DIMENSIONS IN MILLIMETER/(INCH) (.009 – .015) (.004 ± .002) TYP 0.65 MSOP (MS8) 0307 REV F 2. DRAWING NOT TO SCALE 3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. (.0256) MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE BSC 4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS. INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE 5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX 172234fb 16
PACKAGE DESCRIPTION S8 Package 8-Lead Plastic Small Outline (Narrow .150 Inch)
(Reference LTC DWG # 05-08-1610) .189 – .197 (4.801 – 5.004) .045 ±.005 NOTE 3 .050 BSC 8 7 6 5 .245 MIN .160 ±.005 .150 – .157 .228 – .244 (3.810 – 3.988) (5.791 – 6.197) NOTE 3 .030 ±.005 TYP 1 2 3 4 RECOMMENDED SOLDER PAD LAYOUT .010 – .020 s 45° .053 – .069 (0.254 – 0.508) (1.346 – 1.752) .004 – .010 .008 – .010 0°– 8° TYP (0.101 – 0.254) (0.203 – 0.254) .016 – .050 .014 – .019 .050 (0.406 – 1.270) (0.355 – 0.483) (1.270) NOTE: TYP BSC INCHES 1. DIMENSIONS IN (MILLIMETERS) 2. DRAWING NOT TO SCALE 3. THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .006" (0.15mm) SO8 0303
MS8 Package 8-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1660 Rev F) 3.00 ± 0.102 0.889 ± 0.127 (.118 ± .004) 0.52 (.035 ± .005) (NOTE 3) 8 7 6 5 (.0205) REF 5.23 3.20 – 3.45 3.00 ± 0.102 (.206) 4.90 ± 0.152 (.126 – .136) DETAIL “A” (.118 ± .004) MIN 0.254 (.193 ± .006) (NOTE 4) (.010) 0° – 6° TYP GAUGE PLANE 0.42 ± 0.038 0.65 (.0165 ± .0015) (.0256) 1 2 3 4 TYP BSC 0.53 ± 0.152 (.021 ± .006) 1.10 0.86 RECOMMENDED SOLDER PAD LAYOUT (.043) (.034) DETAIL “A” MAX REF 0.18 (.007) SEATING PLANE NOTE: 0.22 – 0.38 0.1016 ± 0.0508 1. DIMENSIONS IN MILLIMETER/(INCH) (.009 – .015) (.004 ± .002) TYP 0.65 MSOP (MS8) 0307 REV F 2. DRAWING NOT TO SCALE 3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. (.0256) MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE BSC 4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS. INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE 5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX 172234fb 16