Datasheet LTC6800 (Analog Devices) - 12

LTC6800 package DescripTion
MS8 Package 8-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1660 Rev F) 3.00 p 0.102 (.118 p .004) 0.52 (NOTE 3) 8 7 6 5 (.0205) REF 4.90 p 0.152 3.00 p 0.102 0.889 p 0.127 DETAIL “A” (.118 p .004) (.035 p .005) 0.254 (.193 p .006) (NOTE 4) (.010) 0o – 6o TYP GAUGE PLANE 5.23 3.20 – 3.45 1 2 3 4 (.206) (.126 – .136) 0.53 p 0.152 MIN (.021 p .006) 1.10 0.86 (.043) (.034) DETAIL “A” MAX REF 0.18 0.42 p 0.038 0.65 (.007) (.0165 p .0015) (.0256) TYP BSC SEATING PLANE 0.22 – 0.38 0.1016 RECOMMENDED SOLDER PAD LAYOUT p 0.0508 (.009 – .015) (.004 p .002) NOTE: TYP 0.65 MSOP (MS8) 0307 REV F 1. DIMENSIONS IN MILLIMETER/(INCH) (.0256) 2. DRAWING NOT TO SCALE BSC 3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE 4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS. INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE 5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX 6800fb Document Outline Features Applications Description Typical Application Absolute Maximum Ratings Pin Configuration Order Information Electrical Characteristics Typical Performance Characteristics Pin Functions Block Diagram Applications Information Typical Applications Package Description Revision History Related Parts Typical Application