Datasheet LTC2058 (Analog Devices) - 26
| 制造商 | Analog Devices |
| 描述 | 36V, Low Noise Zero-Drift Operational Amplifier |
| 页数 / 页 | 28 / 26 — PACKAGE DESCRIPTION. S8E Package. 8-Lead Plastic SOIC (Narrow .150 Inch) … |
| 文件格式/大小 | PDF / 2.0 Mb |
| 文件语言 | 英语 |
PACKAGE DESCRIPTION. S8E Package. 8-Lead Plastic SOIC (Narrow .150 Inch) Exposed Pad
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LTC2058
PACKAGE DESCRIPTION S8E Package 8-Lead Plastic SOIC (Narrow .150 Inch) Exposed Pad
(Reference LTC DWG # 05-08-1857 Rev C) .189 – .197 (4.801 – 5.004) .050 NOTE 3 (1.27) .045 ±.005 BSC (1.143 ±0.127) .005 (0.13) MAX 8 7 6 5 .245 .089 .160 ±.005 .080 – .099 .150 – .157 .228 – .244 (6.22) (2.26) (4.06 ±0.127) (2.032 – 2.530) (3.810 – 3.988) (5.791 – 6.197) MIN REF NOTE 3 1 2 3 4 .030 ±.005 .118 – .139 (0.76 ±0.127) .118 (2.997 – 3.550) TYP (2.99) REF RECOMMENDED SOLDER PAD LAYOUT .010 – .020 × 45° (0.254 – 0.508) .053 – .069 4 5 (1.346 – 1.752) .008 – .010 .004 – .010 0.0 – 0.005 0 (0.203 – 0.254) °– 8° TYP (0.101 – 0.254) (0.0 – 0.130) .016 – .050 .014 – .019 .050 (0.406 – 1.270) (0.355 – 0.483) (1.270) NOTE: INCHES TYP BSC S8E 1015 REV C 1. DIMENSIONS IN (MILLIMETERS) 2. DRAWING NOT TO SCALE 3. THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .010" (0.254mm) 4. STANDARD LEAD STANDOFF IS 4mils TO 10mils (DATE CODE BEFORE 542) 5. LOWER LEAD STANDOFF IS 0mils TO 5mils (DATE CODE AFTER 542) Rev 0 26 For more information www.analog.com Document Outline Features Applications Typical Application Description Absolute Maximum Ratings Pin Configuration Order Information Electrical Characteristics Typical Performance Characteristics Pin Functions Block Diagrams Applications Information Typical Applications Package Description Typical Application Related Parts
PACKAGE DESCRIPTION S8E Package 8-Lead Plastic SOIC (Narrow .150 Inch) Exposed Pad
(Reference LTC DWG # 05-08-1857 Rev C) .189 – .197 (4.801 – 5.004) .050 NOTE 3 (1.27) .045 ±.005 BSC (1.143 ±0.127) .005 (0.13) MAX 8 7 6 5 .245 .089 .160 ±.005 .080 – .099 .150 – .157 .228 – .244 (6.22) (2.26) (4.06 ±0.127) (2.032 – 2.530) (3.810 – 3.988) (5.791 – 6.197) MIN REF NOTE 3 1 2 3 4 .030 ±.005 .118 – .139 (0.76 ±0.127) .118 (2.997 – 3.550) TYP (2.99) REF RECOMMENDED SOLDER PAD LAYOUT .010 – .020 × 45° (0.254 – 0.508) .053 – .069 4 5 (1.346 – 1.752) .008 – .010 .004 – .010 0.0 – 0.005 0 (0.203 – 0.254) °– 8° TYP (0.101 – 0.254) (0.0 – 0.130) .016 – .050 .014 – .019 .050 (0.406 – 1.270) (0.355 – 0.483) (1.270) NOTE: INCHES TYP BSC S8E 1015 REV C 1. DIMENSIONS IN (MILLIMETERS) 2. DRAWING NOT TO SCALE 3. THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .010" (0.254mm) 4. STANDARD LEAD STANDOFF IS 4mils TO 10mils (DATE CODE BEFORE 542) 5. LOWER LEAD STANDOFF IS 0mils TO 5mils (DATE CODE AFTER 542) Rev 0 26 For more information www.analog.com Document Outline Features Applications Typical Application Description Absolute Maximum Ratings Pin Configuration Order Information Electrical Characteristics Typical Performance Characteristics Pin Functions Block Diagrams Applications Information Typical Applications Package Description Typical Application Related Parts