Datasheet LTC7862 (Analog Devices) - 30
| 制造商 | Analog Devices |
| 描述 | 140V High Efficiency Switching Surge Stopper |
| 页数 / 页 | 32 / 30 — PACKAGE DESCRIPTION. Please refer to … |
| 文件格式/大小 | PDF / 1.7 Mb |
| 文件语言 | 英语 |
PACKAGE DESCRIPTION. Please refer to http://www.linear.com/product/LTC7862#packaging for the most recent package drawings
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LTC7862
PACKAGE DESCRIPTION Please refer to http://www.linear.com/product/LTC7862#packaging for the most recent package drawings. UFD Package 20-Lead Plastic QFN (4mm × 5mm) 20-Lead Plastic QFN (4mm
×
5mm)
(Reference LTC DWG # 05-08-1711 Rev B) (Reference LTC DWG # 05-08-1711 Rev B) 0.70 ±0.05 2.65 ±0.05 4.50 ±0.05 1.50 REF 3.10 ±0.05 3.65 ±0.05 PACKAGE OUTLINE 0.25 ±0.05 0.50 BSC 2.50 REF 4.10 ±0.05 5.50 ±0.05 RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED PIN 1 NOTCH R = 0.20 OR 4.00 ±0.10 0.75 ±0.05 R = 0.05 TYP 1.50 REF C = 0.35 (2 SIDES) 19 20 0.40 ±0.10 PIN 1 TOP MARK (NOTE 6) 1 2 5.00 ±0.10 2.50 REF (2 SIDES) 3.65 ±0.10 2.65 ±0.10 (UFD20) QFN 0506 REV B 0.200 REF R = 0.115 0.25 ±0.05 TYP 0.00 – 0.05 0.50 BSC BOTTOM VIEW—EXPOSED PAD NOTE: 1. DRAWING PROPOSED TO BE MADE A JEDEC PACKAGE OUTLINE MO-220 VARIATION (WXXX-X). 2. DRAWING NOT TO SCALE 3. ALL DIMENSIONS ARE IN MILLIMETERS 4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE 5. EXPOSED PAD SHALL BE SOLDER PLATED 6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE Rev 0 30 For more information www.analog.com Document Outline FEATURES DESCRIPTION APPLICATIONS TYPICAL APPLICATION ABSOLUTE MAXIMUM RATINGS PIN CONFIGURATION ORDER INFORMATION ELECTRICAL CHARACTERISTICS TYPICAL PERFORMANCE CHARACTERISTICS PIN FUNCTIONS TIMING DIAGRAM FUNCTIONAL DIAGRAM OPERATION APPLICATIONS INFORMATION TYPICAL APPLICATIONS PACKAGE DESCRIPTION TYPICAL APPLICATION RELATED PARTS
PACKAGE DESCRIPTION Please refer to http://www.linear.com/product/LTC7862#packaging for the most recent package drawings. UFD Package 20-Lead Plastic QFN (4mm × 5mm) 20-Lead Plastic QFN (4mm
×
5mm)
(Reference LTC DWG # 05-08-1711 Rev B) (Reference LTC DWG # 05-08-1711 Rev B) 0.70 ±0.05 2.65 ±0.05 4.50 ±0.05 1.50 REF 3.10 ±0.05 3.65 ±0.05 PACKAGE OUTLINE 0.25 ±0.05 0.50 BSC 2.50 REF 4.10 ±0.05 5.50 ±0.05 RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED PIN 1 NOTCH R = 0.20 OR 4.00 ±0.10 0.75 ±0.05 R = 0.05 TYP 1.50 REF C = 0.35 (2 SIDES) 19 20 0.40 ±0.10 PIN 1 TOP MARK (NOTE 6) 1 2 5.00 ±0.10 2.50 REF (2 SIDES) 3.65 ±0.10 2.65 ±0.10 (UFD20) QFN 0506 REV B 0.200 REF R = 0.115 0.25 ±0.05 TYP 0.00 – 0.05 0.50 BSC BOTTOM VIEW—EXPOSED PAD NOTE: 1. DRAWING PROPOSED TO BE MADE A JEDEC PACKAGE OUTLINE MO-220 VARIATION (WXXX-X). 2. DRAWING NOT TO SCALE 3. ALL DIMENSIONS ARE IN MILLIMETERS 4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE 5. EXPOSED PAD SHALL BE SOLDER PLATED 6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE Rev 0 30 For more information www.analog.com Document Outline FEATURES DESCRIPTION APPLICATIONS TYPICAL APPLICATION ABSOLUTE MAXIMUM RATINGS PIN CONFIGURATION ORDER INFORMATION ELECTRICAL CHARACTERISTICS TYPICAL PERFORMANCE CHARACTERISTICS PIN FUNCTIONS TIMING DIAGRAM FUNCTIONAL DIAGRAM OPERATION APPLICATIONS INFORMATION TYPICAL APPLICATIONS PACKAGE DESCRIPTION TYPICAL APPLICATION RELATED PARTS