Datasheet LTM4602 (Analog Devices) - 21
| 制造商 | Analog Devices |
| 描述 | 6A High Efficiency DC/DC µModule |
| 页数 / 页 | 24 / 21 — PACKAGE DESCRIPTION. TOP VIEW. TOLERANCE. SYMBOL. LGA Package. 104-Lead … |
| 文件格式/大小 | PDF / 340 Kb |
| 文件语言 | 英语 |
PACKAGE DESCRIPTION. TOP VIEW. TOLERANCE. SYMBOL. LGA Package. 104-Lead (15mm × 15mm). BOTTOM VIEW. SUGGESTED SOLDER PAD LAYOUT
该数据表的模型线
文件文字版本
LTM4602
PACKAGE DESCRIPTION
aaa Z Y 15 BSC X 15 BSC
TOP VIEW
aaa Z PAD 1 CORNER 4 0.15 0.10 0.15
TOLERANCE
2.72 – 2.92 DETAIL B DETAILS OF PAD #1 IDENTIFIER ARE OPTIONAL, BUT MUST BE LOCATED WITHIN THE ZONE INDICATED. THE PAD #1 IDENTIFIER IS A MARKED FEATURE OR A NOTCHED BEVELED PAD aaa bbb eee
SYMBOL
3 4 TM DWG # 05-05-1800) NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994 2. ALL DIMENSIONS ARE IN MILLIMETERS LAND DESIGNATION PER JESD MO-222, SPP-010 5. PRIMARY DATUM -Z- IS SEATING PLANE 6. THE TOTAL NUMBER OF PADS: 104
LGA Package
0.27 – 0.37 SUBSTRATE Z
104-Lead (15mm × 15mm)
(Reference L Y MOLD CAP DETAIL B X M bbb Z LGA104 0206 eee 3 K H F D B PADS SEE NOTES T R P N M L J G E C A 2.45 – 2.55 6.9865 20 21 22 23 24 24 23 22 21 20 23 6.3500 22 49 60 71 82 93 104 104 93 82 71 60 49 5.7142 19 19 21 5.0800 48 59 70 81 92 103 103 92 81 70 59 48 20 4.4442 18 18 19 3.8100 47 58 69 80 91 102 102 91 80 69 58 47 18 3.1742 17 31 38 38 31 17 17 2.5400 46 57 68 79 90 101 101 90 79 68 57 46 16 1.9042 16 30 37 37 30 16 15 1.2700 11 15 45 56 67 78 89 100 100 89 78 67 56 45 15 11 14 0.6342 7 7 29 36 0.3175 36 29 13 0.0000 0.0000 10 14 44 55 66 77 88 99 0.3175 12.70 BSC 99 88 77 66 55 44 14 10 12 13.93 BSC 0.6358 6 6 28 35 35 28 11 1.2700 9
TOP VIEW
13 43 54 65 76 87 98 98 87 76 65 54 43 9 13 10 1.9058
BOTTOM VIEW
5 5 27 34 34 27 2.5400 42 53 64 75 86 97 97 86 75 64 53 42 3.1758 4 4 26 33 33 26 79 3.8100 5.7650 4.4950 41 52 63 74 85 96 96 85 74 63 52 41 68 4.4458 3 3
SUGGESTED SOLDER PAD LAYOUT
5.0800 40 51 62 73 84 95 95 84 73 62 51 40 5.7158 2 2.3600 1.0900 2 35 6.3500 39 50 61 72 83 94 94 83 72 61 50 39 24 6.9421 1 8 8 1 12 25 32 32 25 12 1 13.97 BSC PAD 1 6.9888 5.2775 2.7375 0.3175 0.3175 2.5400 5.7150 C(0.30) 0.11 – 0.27 0.0000 6.5475 4.0075 1.4675 1.2700 4.4450 6.9850 4602fa 21
PACKAGE DESCRIPTION
aaa Z Y 15 BSC X 15 BSC
TOP VIEW
aaa Z PAD 1 CORNER 4 0.15 0.10 0.15
TOLERANCE
2.72 – 2.92 DETAIL B DETAILS OF PAD #1 IDENTIFIER ARE OPTIONAL, BUT MUST BE LOCATED WITHIN THE ZONE INDICATED. THE PAD #1 IDENTIFIER IS A MARKED FEATURE OR A NOTCHED BEVELED PAD aaa bbb eee
SYMBOL
3 4 TM DWG # 05-05-1800) NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994 2. ALL DIMENSIONS ARE IN MILLIMETERS LAND DESIGNATION PER JESD MO-222, SPP-010 5. PRIMARY DATUM -Z- IS SEATING PLANE 6. THE TOTAL NUMBER OF PADS: 104
LGA Package
0.27 – 0.37 SUBSTRATE Z
104-Lead (15mm × 15mm)
(Reference L Y MOLD CAP DETAIL B X M bbb Z LGA104 0206 eee 3 K H F D B PADS SEE NOTES T R P N M L J G E C A 2.45 – 2.55 6.9865 20 21 22 23 24 24 23 22 21 20 23 6.3500 22 49 60 71 82 93 104 104 93 82 71 60 49 5.7142 19 19 21 5.0800 48 59 70 81 92 103 103 92 81 70 59 48 20 4.4442 18 18 19 3.8100 47 58 69 80 91 102 102 91 80 69 58 47 18 3.1742 17 31 38 38 31 17 17 2.5400 46 57 68 79 90 101 101 90 79 68 57 46 16 1.9042 16 30 37 37 30 16 15 1.2700 11 15 45 56 67 78 89 100 100 89 78 67 56 45 15 11 14 0.6342 7 7 29 36 0.3175 36 29 13 0.0000 0.0000 10 14 44 55 66 77 88 99 0.3175 12.70 BSC 99 88 77 66 55 44 14 10 12 13.93 BSC 0.6358 6 6 28 35 35 28 11 1.2700 9
TOP VIEW
13 43 54 65 76 87 98 98 87 76 65 54 43 9 13 10 1.9058
BOTTOM VIEW
5 5 27 34 34 27 2.5400 42 53 64 75 86 97 97 86 75 64 53 42 3.1758 4 4 26 33 33 26 79 3.8100 5.7650 4.4950 41 52 63 74 85 96 96 85 74 63 52 41 68 4.4458 3 3
SUGGESTED SOLDER PAD LAYOUT
5.0800 40 51 62 73 84 95 95 84 73 62 51 40 5.7158 2 2.3600 1.0900 2 35 6.3500 39 50 61 72 83 94 94 83 72 61 50 39 24 6.9421 1 8 8 1 12 25 32 32 25 12 1 13.97 BSC PAD 1 6.9888 5.2775 2.7375 0.3175 0.3175 2.5400 5.7150 C(0.30) 0.11 – 0.27 0.0000 6.5475 4.0075 1.4675 1.2700 4.4450 6.9850 4602fa 21