Datasheet ADR293 (Analog Devices) - 5
| 制造商 | Analog Devices |
| 描述 | Low Noise, Micropower 5.0 V Precision Voltage Reference |
| 页数 / 页 | 12 / 5 — ADR293. ABSOLUTE MAXIMUM RATINGS. THERMAL RESISTANCE. Table 5. Parameter … |
| 修订版 | D |
| 文件格式/大小 | PDF / 261 Kb |
| 文件语言 | 英语 |
ADR293. ABSOLUTE MAXIMUM RATINGS. THERMAL RESISTANCE. Table 5. Parameter Rating. Table 6. Thermal Resistance. Package Type. θJC. Unit
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ADR293 ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE Table 5. Parameter Rating
θJA is specified for worst-case conditions; that is, θJA is specified Supply Voltage 18 V for the device in socket testing. In practice, θJA is specified for Output Short-Circuit Duration to GND Indefinite the device soldered in a circuit board. Storage Temperature Range −65°C to +150°C
Table 6. Thermal Resistance
Operating Temperature Range −40°C to +125°C
Package Type θ
Junction Temperature Range −65°C to +150°C
JA θJC Unit
Lead Temperature (Soldering, 60 sec) 300°C 8-Lead SOIC_N (R-8) 158 43 °C/W 8-Lead TSSOP (RU-8) 240 43 °C/W Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress
ESD CAUTION
rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Rev. D | Page 5 of 12 Document Outline FEATURES APPLICATIONS PIN CONFIGURATIONS GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ELECTRICAL SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION TYPICAL PERFORMANCE CHARACTERISTICS TERMINOLOGY THEORY OF OPERATION DEVICE POWER DISSIPATION CONSIDERATIONS BASIC VOLTAGE REFERENCE CONNECTIONS NOISE PERFORMANCE TURN-ON TIME APPLICATIONS KELVIN CONNECTIONS VOLTAGE REGULATOR FOR PORTABLE EQUIPMENT OUTLINE DIMENSIONS ORDERING GUIDE
θJA is specified for worst-case conditions; that is, θJA is specified Supply Voltage 18 V for the device in socket testing. In practice, θJA is specified for Output Short-Circuit Duration to GND Indefinite the device soldered in a circuit board. Storage Temperature Range −65°C to +150°C
Table 6. Thermal Resistance
Operating Temperature Range −40°C to +125°C
Package Type θ
Junction Temperature Range −65°C to +150°C
JA θJC Unit
Lead Temperature (Soldering, 60 sec) 300°C 8-Lead SOIC_N (R-8) 158 43 °C/W 8-Lead TSSOP (RU-8) 240 43 °C/W Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress
ESD CAUTION
rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Rev. D | Page 5 of 12 Document Outline FEATURES APPLICATIONS PIN CONFIGURATIONS GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ELECTRICAL SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION TYPICAL PERFORMANCE CHARACTERISTICS TERMINOLOGY THEORY OF OPERATION DEVICE POWER DISSIPATION CONSIDERATIONS BASIC VOLTAGE REFERENCE CONNECTIONS NOISE PERFORMANCE TURN-ON TIME APPLICATIONS KELVIN CONNECTIONS VOLTAGE REGULATOR FOR PORTABLE EQUIPMENT OUTLINE DIMENSIONS ORDERING GUIDE