Datasheet HMC361 (Analog Devices) - 3
| 制造商 | Analog Devices |
| 描述 | GaAs HBT MMIC DIVIDE-BY-2, DC - 11 GHz |
| 页数 / 页 | 6 / 3 — HMC361. GaAs HBT MMIC. DIVIDE-BY-2, DC - 11 GHz. Output Voltage Waveform, … |
| 文件格式/大小 | PDF / 297 Kb |
| 文件语言 | 英语 |
HMC361. GaAs HBT MMIC. DIVIDE-BY-2, DC - 11 GHz. Output Voltage Waveform, Pin= 0 dBm, Fout= 882 MHz, T= 25 °C
该数据表的模型线
文件文字版本
HMC361
v07.0109
GaAs HBT MMIC DIVIDE-BY-2, DC - 11 GHz
1
Output Voltage Waveform, Pin= 0 dBm, Fout= 882 MHz, T= 25 °C Absolute Maximum Ratings
500 RF Input (Vcc = +5V) +13 dBm IP Vcc +5.5V H 300 VLogic Vcc -1.6V to Vcc -1.2V Junction Temperature (T ) 135 °C j 100 Continuous Pdiss (T= 85 °C) 0.79W S - C (derate 15.9 mW/ °C above 85 °C) -100 R Thermal Resistance (R ) TH 63 °C/W AMPLITUDE (mV) E (junction to die bottom) -300 Storage Temperature -65 to +150 °C ID Operating Temperature -55 to +85 °C -500 IV 22.7 23.1 23.5 23.9 24.3 24.7 TIME (nS)
Typical Supply Current vs Vcc
Y D Vcc (V) Icc (mA) 4.75 74 NC ELECTROSTATIC SENSITIVE DEVICE 5.0 83 E OBSERVE HANDLING PRECAUTIONS 5.25 89 U Note: Divider will operate over full voltage range shown above Q E R
Outline Drawing
F
Die Packaging Information
[1] NOTES; 1. ALL DIMENSIONS IN INCHES (MILLIMETERS) Standard Alternate 2. ALL TOLERANCES ARE ± 0.001 (0.025) WP-8 (Waffle Pack) [2] 3. DIE THICKNESS IS 0.004 (0.100) BACKSIDE IS GROUND 4. BOND PADS ARE 0.004 (0.100) SQUARE [1] Refer to the “Packaging Information” section for die 5. BOND PAD SPACING, CTR-CTR: 0.006 (0.150) packaging dimensions. 6. BACKSIDE METALLIZATION: GOLD [2] For alternate packaging information contact Hittite 7. BOND PAD METALLIZATION: GOLD Microwave Corporation. Information furnish F ed obr pri y Anal ce, de og Device li s vie s r beyli, a eve nd to pla d to be accura ce o te and rder reliabl s e , pl . Ho ease co wever, no For price, delivery, and to place orders: Analog Devices, Inc., responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other ntact Hittite Microwave Corporation: One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 rights of third parties that may result from its use. Specifications subject to change without notice. No
1 - 4
20 Alpha Road, Chelmsford, MA 01824 Phone: 978 Phon - e 25 : 7 0 81--3 32 3 9 4 - 3 F 70 ax 0 • O : 978 rder on -li25 n 0 e a - t 33 ww 73 license is granted by implication or otherwise under any patent or patent rights of Analog Devices. w.analog.com Order On Trademarks and registered trademarks are the property of their respective owners. -line at www.h A it p tpite.co licatio m n Support: Phone: 1-800-ANALOG-D
v07.0109
GaAs HBT MMIC DIVIDE-BY-2, DC - 11 GHz
1
Output Voltage Waveform, Pin= 0 dBm, Fout= 882 MHz, T= 25 °C Absolute Maximum Ratings
500 RF Input (Vcc = +5V) +13 dBm IP Vcc +5.5V H 300 VLogic Vcc -1.6V to Vcc -1.2V Junction Temperature (T ) 135 °C j 100 Continuous Pdiss (T= 85 °C) 0.79W S - C (derate 15.9 mW/ °C above 85 °C) -100 R Thermal Resistance (R ) TH 63 °C/W AMPLITUDE (mV) E (junction to die bottom) -300 Storage Temperature -65 to +150 °C ID Operating Temperature -55 to +85 °C -500 IV 22.7 23.1 23.5 23.9 24.3 24.7 TIME (nS)
Typical Supply Current vs Vcc
Y D Vcc (V) Icc (mA) 4.75 74 NC ELECTROSTATIC SENSITIVE DEVICE 5.0 83 E OBSERVE HANDLING PRECAUTIONS 5.25 89 U Note: Divider will operate over full voltage range shown above Q E R
Outline Drawing
F
Die Packaging Information
[1] NOTES; 1. ALL DIMENSIONS IN INCHES (MILLIMETERS) Standard Alternate 2. ALL TOLERANCES ARE ± 0.001 (0.025) WP-8 (Waffle Pack) [2] 3. DIE THICKNESS IS 0.004 (0.100) BACKSIDE IS GROUND 4. BOND PADS ARE 0.004 (0.100) SQUARE [1] Refer to the “Packaging Information” section for die 5. BOND PAD SPACING, CTR-CTR: 0.006 (0.150) packaging dimensions. 6. BACKSIDE METALLIZATION: GOLD [2] For alternate packaging information contact Hittite 7. BOND PAD METALLIZATION: GOLD Microwave Corporation. Information furnish F ed obr pri y Anal ce, de og Device li s vie s r beyli, a eve nd to pla d to be accura ce o te and rder reliabl s e , pl . Ho ease co wever, no For price, delivery, and to place orders: Analog Devices, Inc., responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other ntact Hittite Microwave Corporation: One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 rights of third parties that may result from its use. Specifications subject to change without notice. No
1 - 4
20 Alpha Road, Chelmsford, MA 01824 Phone: 978 Phon - e 25 : 7 0 81--3 32 3 9 4 - 3 F 70 ax 0 • O : 978 rder on -li25 n 0 e a - t 33 ww 73 license is granted by implication or otherwise under any patent or patent rights of Analog Devices. w.analog.com Order On Trademarks and registered trademarks are the property of their respective owners. -line at www.h A it p tpite.co licatio m n Support: Phone: 1-800-ANALOG-D