Datasheet OPA196, OPA2196, OPA4196 - OPAx196 (Texas Instruments) - 6

OPA196 , OPA2196, OPA4196
SBOS869 – JULY 2017
www.ti.com 6.5 Thermal Information: OPA2196 OPA2196 THERMAL METRIC(1) 8 PINS UNIT D (SOIC) DGK (VSSOP)
RθJA Junction-to-ambient thermal resistance 107.9 158 °C/W RθJC(top) Junction-to-case(top) thermal resistance 53.9 48.6 °C/W RθJB Junction-to-board thermal resistance 48.9 78.7 °C/W ψJT Junction-to-top characterization parameter 6.6 3.9 °C/W ψJB Junction-to-board characterization parameter 48.3 77.3 °C/W RθJC(bot) Junction-to-case(bottom) thermal resistance N/A N/A °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
6.6 Thermal Information: OPA4196 OPA4196 THERMAL METRIC(1) 14 PINS UNIT D (SOIC) PW (TSSOP)
RθJA Junction-to-ambient thermal resistance 86.4 92.6 °C/W RθJC(top) Junction-to-case(top) thermal resistance 46.3 27.5 °C/W RθJB Junction-to-board thermal resistance 41.0 33.6 °C/W ψJT Junction-to-top characterization parameter 11.3 1.9 °C/W ψJB Junction-to-board characterization parameter 40.7 33.1 °C/W RθJC(bot) Junction-to-case(bottom) thermal resistance N/A N/A °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 6 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: OPA196 OPA2196 OPA4196 Document Outline 1 Features 2 Applications 3 Description Table of Contents 4 Revision History 5 Pin Configuration and Functions 6 Specifications 6.1 Absolute Maximum Ratings 6.2 ESD Ratings 6.3 Recommended Operating Conditions 6.4 Thermal Information: OPA196 6.5 Thermal Information: OPA2196 6.6 Thermal Information: OPA4196 6.7 Electrical Characteristics: VS = ±4 V to ±18 V (VS = 8 V to 36 V) 6.8 Electrical Characteristics: VS = ±2.25 V to ±4 V (VS = 4.5 V to 8 V) 6.9 Typical Characteristics 7 Detailed Description 7.1 Overview 7.2 Functional Block Diagram 7.3 Feature Description 7.3.1 Input Protection Circuitry 7.3.2 EMI Rejection 7.3.3 Phase Reversal Protection 7.3.4 Thermal Protection 7.3.5 Capacitive Load and Stability 7.3.6 Common-Mode Voltage Range 7.3.7 Electrical Overstress 7.3.8 Overload Recovery 7.4 Device Functional Modes 8 Application and Implementation 8.1 Application Information 8.2 Typical Applications 8.2.1 Low-side Current Measurement 8.2.1.1 Design Requirements 8.2.1.2 Detailed Design Procedure 8.2.1.3 Application Curves 8.2.2 16-Bit Precision Multiplexed Data-Acquisition System 8.2.2.1 Design Requirements 8.2.2.2 Detailed Design Procedure 8.2.3 Slew Rate Limit for Input Protection 9 Power-Supply Recommendations 10 Layout 10.1 Layout Guidelines 10.2 Layout Example 11 Device and Documentation Support 11.1 Device Support 11.1.1 Development Support 11.1.1.1 TINA-TI (Free Software Download) 11.1.1.2 TI Precision Designs 11.2 Documentation Support 11.2.1 Related Documentation 11.3 Related Links 11.4 Receiving Notification of Documentation Updates 11.5 Community Resources 11.6 Trademarks 11.7 Electrostatic Discharge Caution 11.8 Glossary 12 Mechanical, Packaging, and Orderable Information