Datasheet LT1528 (Analog Devices) - 11
| 制造商 | Analog Devices |
| 描述 | 3A Low Dropout Regulator for Microprocessor Applications |
| 页数 / 页 | 12 / 11 — PACKAGE DESCRIPTION. Q Package. 5-Lead Plastic DD Pak |
| 文件格式/大小 | PDF / 170 Kb |
| 文件语言 | 英语 |
PACKAGE DESCRIPTION. Q Package. 5-Lead Plastic DD Pak
该数据表的模型线
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LT1528
PACKAGE DESCRIPTION Q Package 5-Lead Plastic DD Pak
(Reference LTC DWG # 05-08-1461) .060 (1.524) .390 – .415 TYP (9.906 – 10.541) .060 .165 – .180 .256 (1.524) (6.502) (4.191 – 4.572) .045 – .055 (1.143 – 1.397) 15° TYP +.008 .004 .060 –.004 .183 .059 .330 – .370 (1.524) (4.648) (1.499) (8.382 – 9.398) TYP ( +0.203 0.102 –0.102) .095 – .115 (2.413 – 2.921) .075 (1.905) .067 .050 ± .012 .300 +.012 .013 – .023 .143 (1.702) (1.270 (7.620) –.020 ± 0.305) (0.330 – 0.584) .028 – .038 BSC +0.305 BOTTOM VIEW OF DD PAK 3.632 (0.711 – 0.965) Q(DD5) 0502 HATCHED AREA IS SOLDER PLATED ( –0.508) TYP COPPER HEAT SINK .420 .080 .420 .276 .350 .325 .205 .565 .565 .320 .090 .090 .067 .042 .067 .042 RECOMMENDED SOLDER PAD LAYOUT RECOMMENDED SOLDER PAD LAYOUT FOR THICKER SOLDER PASTE APPLICATIONS NOTE: 1. DIMENSIONS IN INCH/(MILLIMETER) 2. DRAWING NOT TO SCALE 1528fb Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa- tion that the interconnection of its circuits as described herein will not infringe on existing patent rights. 11
PACKAGE DESCRIPTION Q Package 5-Lead Plastic DD Pak
(Reference LTC DWG # 05-08-1461) .060 (1.524) .390 – .415 TYP (9.906 – 10.541) .060 .165 – .180 .256 (1.524) (6.502) (4.191 – 4.572) .045 – .055 (1.143 – 1.397) 15° TYP +.008 .004 .060 –.004 .183 .059 .330 – .370 (1.524) (4.648) (1.499) (8.382 – 9.398) TYP ( +0.203 0.102 –0.102) .095 – .115 (2.413 – 2.921) .075 (1.905) .067 .050 ± .012 .300 +.012 .013 – .023 .143 (1.702) (1.270 (7.620) –.020 ± 0.305) (0.330 – 0.584) .028 – .038 BSC +0.305 BOTTOM VIEW OF DD PAK 3.632 (0.711 – 0.965) Q(DD5) 0502 HATCHED AREA IS SOLDER PLATED ( –0.508) TYP COPPER HEAT SINK .420 .080 .420 .276 .350 .325 .205 .565 .565 .320 .090 .090 .067 .042 .067 .042 RECOMMENDED SOLDER PAD LAYOUT RECOMMENDED SOLDER PAD LAYOUT FOR THICKER SOLDER PASTE APPLICATIONS NOTE: 1. DIMENSIONS IN INCH/(MILLIMETER) 2. DRAWING NOT TO SCALE 1528fb Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa- tion that the interconnection of its circuits as described herein will not infringe on existing patent rights. 11