Datasheet LTC2486 (Analog Devices) - 34
| 制造商 | Analog Devices |
| 描述 | 16-Bit 2-/4-Channel ∆Σ ADC with PGA and Easy Drive Input Current Cancellation |
| 页数 / 页 | 36 / 34 — PACKAGE DESCRIPTION. DE Package. 14-Lead Plastic DFN (4mm. 3mm) |
| 文件格式/大小 | PDF / 502 Kb |
| 文件语言 | 英语 |
PACKAGE DESCRIPTION. DE Package. 14-Lead Plastic DFN (4mm. 3mm)
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LTC2486
PACKAGE DESCRIPTION DE Package 14-Lead Plastic DFN (4mm
×
3mm)
(Reference LTC DWG # 05-08-1708 Rev B) 0.70 ±0.05 3.60 ±0.05 3.30 ±0.05 2.20 ±0.05 1.70 ±0.05 PACKAGE OUTLINE 0.25 ±0.05 0.50 BSC 3.00 REF RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED 4.00 ±0.10 R = 0.115 0.40 ±0.10 (2 SIDES) TYP 8 14 R = 0.05 TYP 3.30 ±0.10 3.00 ±0.10 (2 SIDES) 1.70 ±0.10 PIN 1 NOTCH PIN 1 R = 0.20 OR TOP MARK 0.35 × 45° (SEE NOTE 6) CHAMFER (DE14) DFN 0806 REV B 7 1 0.200 REF 0.75 ±0.05 0.25 ±0.05 0.50 BSC 3.00 REF 0.00 – 0.05 BOTTOM VIEW—EXPOSED PAD NOTE: 1. DRAWING PROPOSED TO BE MADE VARIATION OF VERSION (WGED-3) IN JEDEC PACKAGE OUTLINE MO-229 2. DRAWING NOT TO SCALE 3. ALL DIMENSIONS ARE IN MILLIMETERS 4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE 5. EXPOSED PAD SHALL BE SOLDER PLATED 6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE 2486fe 34 For more information www.linear.com/LTC2486 Document Outline Features Applications Description Typical Application Absolute Maximum Ratings Pin Configuration Order Information Electrical Characteristics (Normal Speed) Electrical Characteristics (2x Speed) Converter Characteristics Analog Input and Reference Digital Inputs and Digital Outputs Power Requirements Typical Performance Characteristics Pin Functions Functional Block Diagram Test Circuits Timing Diagrams Applications Information Package Description Revision History Typical Application Related Parts
PACKAGE DESCRIPTION DE Package 14-Lead Plastic DFN (4mm
×
3mm)
(Reference LTC DWG # 05-08-1708 Rev B) 0.70 ±0.05 3.60 ±0.05 3.30 ±0.05 2.20 ±0.05 1.70 ±0.05 PACKAGE OUTLINE 0.25 ±0.05 0.50 BSC 3.00 REF RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED 4.00 ±0.10 R = 0.115 0.40 ±0.10 (2 SIDES) TYP 8 14 R = 0.05 TYP 3.30 ±0.10 3.00 ±0.10 (2 SIDES) 1.70 ±0.10 PIN 1 NOTCH PIN 1 R = 0.20 OR TOP MARK 0.35 × 45° (SEE NOTE 6) CHAMFER (DE14) DFN 0806 REV B 7 1 0.200 REF 0.75 ±0.05 0.25 ±0.05 0.50 BSC 3.00 REF 0.00 – 0.05 BOTTOM VIEW—EXPOSED PAD NOTE: 1. DRAWING PROPOSED TO BE MADE VARIATION OF VERSION (WGED-3) IN JEDEC PACKAGE OUTLINE MO-229 2. DRAWING NOT TO SCALE 3. ALL DIMENSIONS ARE IN MILLIMETERS 4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE 5. EXPOSED PAD SHALL BE SOLDER PLATED 6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE 2486fe 34 For more information www.linear.com/LTC2486 Document Outline Features Applications Description Typical Application Absolute Maximum Ratings Pin Configuration Order Information Electrical Characteristics (Normal Speed) Electrical Characteristics (2x Speed) Converter Characteristics Analog Input and Reference Digital Inputs and Digital Outputs Power Requirements Typical Performance Characteristics Pin Functions Functional Block Diagram Test Circuits Timing Diagrams Applications Information Package Description Revision History Typical Application Related Parts