Datasheet NCS20071, NCV20071, NCS20072, NCV20072, NCS20074, NCV20074 (ON Semiconductor) - 19
| 制造商 | ON Semiconductor |
| 描述 | Operational Amplifier, Wide supply range, 3Mhz CMOS Op-Amp |
| 页数 / 页 | 25 / 19 — NCS20071, NCV20071, NCS20072, NCV20072, NCS20074, NCV20074. PACKAGE … |
| 修订版 | 14 |
| 文件格式/大小 | PDF / 950 Kb |
| 文件语言 | 英语 |
NCS20071, NCV20071, NCS20072, NCV20072, NCS20074, NCV20074. PACKAGE DIMENSIONS. SOT−553, 5 LEAD. −X−. MILLIMETERS. INCHES. −Y−. DIM
该数据表的模型线
文件文字版本
NCS20071, NCV20071, NCS20072, NCV20072, NCS20074, NCV20074 PACKAGE DIMENSIONS SOT−553, 5 LEAD
CASE 463B ISSUE C
D
NOTES:
A
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
−X−
2. CONTROLLING DIMENSION: MILLIMETERS
L
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL.
5 4 E MILLIMETERS INCHES −Y− HE DIM MIN NOM MAX MIN NOM MAX 1 2 3 A
0.50 0.55 0.60 0.020 0.022 0.024
b
0.17 0.22 0.27 0.007 0.009 0.011
c
0.08 0.13 0.18 0.003 0.005 0.007
b D
1.55 1.60 1.65 0.061 0.063 0.065
5 PL c e E
1.15 1.20 1.25 0.045 0.047 0.049 0.08 (0.003) M X Y
e
0.50 BSC 0.020 BSC
L
0.10 0.20 0.30 0.004 0.008 0.012
H E
1.55 1.60 1.65 0.061 0.063 0.065
RECOMMENDED SOLDERING FOOTPRINT*
0.3 0.0118 0.45 0.0177 1.0 1.35 0.0394 0.0531 0.5 0.5 0.0197 0.0197 SCALE 20:1 ǒ mm Ǔ inches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com 19
CASE 463B ISSUE C
D
NOTES:
A
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
−X−
2. CONTROLLING DIMENSION: MILLIMETERS
L
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL.
5 4 E MILLIMETERS INCHES −Y− HE DIM MIN NOM MAX MIN NOM MAX 1 2 3 A
0.50 0.55 0.60 0.020 0.022 0.024
b
0.17 0.22 0.27 0.007 0.009 0.011
c
0.08 0.13 0.18 0.003 0.005 0.007
b D
1.55 1.60 1.65 0.061 0.063 0.065
5 PL c e E
1.15 1.20 1.25 0.045 0.047 0.049 0.08 (0.003) M X Y
e
0.50 BSC 0.020 BSC
L
0.10 0.20 0.30 0.004 0.008 0.012
H E
1.55 1.60 1.65 0.061 0.063 0.065
RECOMMENDED SOLDERING FOOTPRINT*
0.3 0.0118 0.45 0.0177 1.0 1.35 0.0394 0.0531 0.5 0.5 0.0197 0.0197 SCALE 20:1 ǒ mm Ǔ inches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com 19