Datasheet Vishay THJP0612ABT1 — 数据表

THJP
www.vishay.com Vishay Dale Thin Film ThermaWickTM Thermal Jumper Surface Mount Chip
FEATURES
• Electrically isolated thermal conductor
• High thermal conductivity AlN substrate
(170 W/m°K) Available Available • Electrically isolated terminations
• Low capacitance
• Available with SnPb or lead (Pb)-free wrap
terminations Available • Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912 ADDITIONAL RESOURCES
3D 3D
3D Models THJP surface mount chips are designed to provide an
electrically isolated thermal conductive pathway to a ground
plane or heat sink while maintaining the electrical isolation of
the device. The devices are constructed with aluminum
nitride substrates in both SnPb and Pb-free wraparound
termination styles. The low capacitance of the device makes
them an excellent choice for high frequency and thermal
ladder applications. Custom sizes available. APPLICATIONS
• Power supplies and converters
• RF amplifiers
• Synthesizers
• Switch mode power supplies …