Package Linear Technology TSSOP-38/3 — 数据表

FTE Package
38-Lead Plastic TSSOP (4.4mm) (Reference LTC DWG # 05-08-1917 Rev Г?)
Topside Exposed Pad 38 9.60 – 9.80*
(.378 – .386)
4.75 REF
(.187) 20 6.60 В±0.10
4.50 REF
6.40
2.74
REF (.252)
(.108)
BSC 0.315 В±0.05
SEE NOTE 4 1.05 В±0.10 PIN 1
INDEX 0.50 BSC
RECOMMENDED SOLDER PAD LAYOUT 4.30 – 4.50*
(.169 – .177) 0.09 – 0.20
(.0035 – .0079) 0.50 – 0.75
(.020 – .030) NOTE:
1. CONTROLLING DIMENSION: MILLIMETERS
2. DIMENSIONS ARE IN MILLIMETERS
(INCHES)
3. DRAWING NOT TO SCALE 1
0.25 …