Package Linear Technology TSSOP-38/2 — 数据表

FE Package
38-Lead Plastic TSSOP (4.4mm) (Reference LTC DWG # 05-08-1779 Rev Г?)
Split Exposed Pad Variation AC 4.75 REF 9.60 – 9.80*
(.378 – .386)
4.75 REF
(.187) 38 20 0.45 6.60 В±0.10
4.50 REF 2.74 REF 2.38
(.094)
0.45
(.018)
REF SEE NOTE 4 2.70 1.60 0.315 В±0.05
1.05 В±0.10 2.74
(.108)
REF 0.50 BSC
RECOMMENDED SOLDER PAD LAYOUT
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED 4.30 – 4.50*
(.169 – .177) 0.09 – 0.20
(.0035 – .0079) 0.50 – 0.75
(.020 – .030) NOTE:
1. CONTROLLING DIMENSION: MILLIMETERS
2. DIMENSIONS ARE IN MILLIMETERS
(INCHES)
3. DRAWING NOT TO SCALE 0.25 …