Package Linear Technology TSSOP-28/1 — 数据表

FE Package
28-Lead Plastic TSSOP (4.4mm) (Reference LTC DWG # 05-08-1663 Rev K)
Exposed Pad Variation EA
9.60 – 9.80*
(.378 – .386)
7.56
(.298) 7.56
(.298) 28 2726 25 24 23 22 21 20 19 18 1716 15
6.60 В±0.10
4.50 В±0.10 3.05
(.120)
SEE NOTE 4 0.45 В±0.05 EXPOSED
PAD HEAT SINK
ON BOTTOM OF
PACKAGE 6.40
3.05 (.252)
(.120) BSC 1.05 В±0.10
0.65 BSC
RECOMMENDED SOLDER PAD LAYOUT 4.30 – 4.50*
(.169 – .177) 0.09 – 0.20
(.0035 – .0079) 0.50 – 0.75
(.020 – .030) NOTE:
1. CONTROLLING DIMENSION: MILLIMETERS …