Package Linear Technology TSSOP-20/2 — 数据表

FE Package
20-Lead Plastic TSSOP (4.4mm) (Reference LTC DWG # 05-08-1663 Rev K)
Exposed Pad Variation CB
DETAIL A 6.40 – 6.60*
(.252 – .260)
3.86
(.152) 3.86
(.152) 0.60
(.024)
REF
0.28
(.011)
REF 20 1918 17 16 15 14 13 12 11 6.60 В±0.10 2.74
(.108) 4.50 В±0.10 DETAIL A 6.40
2.74 (.252)
(.108) BSC SEE NOTE 4 0.45 В±0.05
1.05 В±0.10
0.65 BSC 1 2 3 4 5 6 7 8 9 10 RECOMMENDED SOLDER PAD LAYOUT 4.30 – 4.50*
(.169 – .177) 0.09 – 0.20
(.0035 – .0079) 0.25
REF 0.50 – 0.75
(.020 – .030) NOTE:
1. CONTROLLING DIMENSION: MILLIMETERS …