Package Linear Technology TSSOP-16/1 — 数据表

FE Package
16-Lead Plastic TSSOP (4.4mm) (Reference LTC DWG # 05-08-1663 Rev K)
Exposed Pad Variation BB
4.70
(.185)
3.58
(.141) DETAIL A 4.90 – 5.10*
(.193 – .201) 0.56
(.022)
REF 3.58
(.141) NOTE 5 16 1514 13 12 1110 9 NOTE 5 6.60 В±0.10 2.94 3.05
(.116) (.120) 4.50 В±0.10 DETAIL A SEE NOTE 4 2.94 6.40
(.116) (.252)
BSC 1.05 В±0.10
0.65 BSC 0.45 В±0.05
1 2 3 4 5 6 7 8 RECOMMENDED SOLDER PAD LAYOUT 4.30 – 4.50*
(.169 – .177) 0.09 – 0.20
(.0035 – .0079) 0.25
REF 0.50 – 0.75
(.020 – .030) NOTE:
1. CONTROLLING DIMENSION: MILLIMETERS
MILLIMETERS
2. DIMENSIONS ARE IN …