MSE Package
16-Lead Plastic MSOP, Exposed Die Pad
(Reference LTC DWG # 05-08-1667 Rev F) BOTTOM VIEW OF
EXPOSED PAD OPTION
2.845 В±0.102
(.112 В±.004) 5.10
(.201)
MIN 2.845 В±0.102
(.112 В±.004) 0.889 В±0.127
(.035 В±.005) 8 1 1.651 В±0.102
(.065 ±.004) 1.651 ±0.102 3.20 – 3.45
(.065 ±.004) (.126 – .136) 0.305 ±0.038
(.0120 В±.0015)
TYP 16 0.50
(.0197)
BSC 4.039 В±0.102
(.159 В±.004)
(NOTE 3) RECOMMENDED SOLDER PAD LAYOUT 0.254
(.010) 0.35
REF 0.280 В±0.076
(.011 В±.003)
REF 16151413121110 9 DETAIL “A”
0В° – 6В° TYP 3.00 В±0.102 …