Package Linear Technology MS-16E — 数据表

MSE Package
Variation: MSE16 (12)
16-Lead Plastic MSOP with 4 Pins Removed
Exposed Die Pad
(Reference LTC DWG # 05-08-1871 Rev D) BOTTOM VIEW OF
EXPOSED PAD OPTION
2.845 В±0.102
(.112 В±.004) 5.10
(.201)
MIN 2.845 В±0.102
(.112 В±.004) 0.889 В±0.127
(.035 В±.005) 8 1 1.651 В±0.102
(.065 ±.004) 1.651 ±0.102 3.20 – 3.45
(.065 ±.004) (.126 – .136) 16 0.305 ±0.038
(.0120 В±.0015)
TYP 0.50
(.0197)
1.0 BSC
(.039)
BSC
RECOMMENDED SOLDER PAD LAYOUT
0.254
(.010) 0.35 …