Package Linear Technology MS-12E — 数据表

MSE Package
12-Lead Plastic MSOP, Exposed Die Pad
(Reference LTC DWG # 05-08-1666 Rev G) BOTTOM VIEW OF
EXPOSED PAD OPTION
2.845 В±0.102
(.112 В±.004) 5.10
(.201)
MIN 2.845 В±0.102
(.112 В±.004) 0.889 В±0.127
(.035 В±.005) 6 1 1.651 В±0.102
(.065 ±.004) 1.651 ±0.102 3.20 – 3.45
(.065 ±.004) (.126 – .136) 12 0.65
0.42 В±0.038
(.0256)
(.0165 В±.0015)
BSC
TYP
RECOMMENDED SOLDER PAD LAYOUT 0.254
(.010) 0.35
REF 4.039 В±0.102
(.159 В±.004)
(NOTE 3) 0.406 В±0.076
(.016 В±.003) …