MSE Package
10-Lead Plastic MSOP, Exposed Die Pad
(Reference LTC DWG # 05-08-1664 Rev I) BOTTOM VIEW OF
EXPOSED PAD OPTION 1.88 В±0.102
(.074 В±.004) 5.10
(.201)
MIN 1 0.889 В±0.127
(.035 В±.005) 1.68 В±0.102
(.066 В±.004) 0.05 REF 10 0.305 В± 0.038
(.0120 В±.0015)
TYP
RECOMMENDED SOLDER PAD LAYOUT 3.00 В±0.102
(.118 В±.004)
(NOTE 3) DETAIL “B”
CORNER TAIL IS PART OF
DETAIL “B” THE LEADFRAME FEATURE.
FOR REFERENCE ONLY
NO MEASUREMENT PURPOSE 10 9 8 7 6 DETAIL “A”
0° – 6° TYP 1 2 3 4 5 GAUGE PLANE 0.53 ±0.152
(.021 В±.006)
DETAIL “A” 0.18
(.007) 0.497 В±0.076
(.0196 В±.003) …