Package Linear Technology MS-8E — 数据表

MS8E Package
8-Lead Plastic MSOP, Exposed Die Pad
(Reference LTC DWG # 05-08-1662 Rev K) BOTTOM VIEW OF
EXPOSED PAD OPTION
1.88
(.074) 1 1.88 В±0.102
(.074 В±.004) 0.29
REF 1.68
(.066) 0.889 В±0.127
(.035 В±.005) 0.05 REF 5.10
(.201)
MIN DETAIL “B”
CORNER TAIL IS PART OF
DETAIL “B” THE LEADFRAME FEATURE.
FOR REFERENCE ONLY
NO MEASUREMENT PURPOSE 1.68 ±0.102 3.20 – 3.45
(.066 ±.004) (.126 – .136)
8
3.00 В±0.102
(.118 В±.004)
(NOTE 3) 0.65
(.0256)
BSC 0.42 В±0.038 …