Hermetic Packages for Integrated Circuits Package Outline Drawing
J8.A
8 PIN 6mmx6mm HERMETIC SURFACE MOUNT PACKAGE
Rev 0, 3/16
PIN #1 INDEX AREA
6.00 В±0.13 #1 #8 #4 #5 6.00 В±0.13 TOP VIEW SIDE VIEW 1.78 В±0.20 END VIEW 1.90 В±0.08 (8x) 2.00 В±0.08 0.10 TYPICAL (REF) 1.00 TYPICAL (REF)
#4
#5 0.90 В±0.08 (8x) 4.20 В±0.08 (2x) 0.70 TYPICAL (REF) 1.40 В±0.08 (6x) #8 #1
0.45 REF x45В°
BOTTOM VIEW NOTES:
1. The corner shape (radius, chamfer, etc.) may vary at the manufacturers option from that shown on the drawing.
2. The package thickness dimension is the package height before being solder dipped.
3. Dimensions are in millimeters. 1 2.9000 1.0000 0.0000 1.0000 1.4500 2.9000 Hermetic Packages for Integrated Circuits 2.5500 2.5500 2.1000 1.1500 1.1500 1.6500 1.6500 2.5500 2.5500 2.9000 0.2500
0.0000
0.2500 1.0000 0.2500
0.0000
0.2500 0.0000 1.1500 1.0000 1.6500 1.1500 2.9000 1.6500 TYPICAL RECOMMENDED LAND PATTERN 2 …
