Hermetic Packages for Integrated Circuits Package Outline Drawing
J4.A
4 PIN 9.0mmx4.7mm HERMETIC SURFACE MOUNT PACKAGE
Rev 0, 2/16
#4
GATE #3
DRAIN 4.70 В±0.13 SOURCE
#1 SUBSTRATE
#2 1.82
В±0.20 9.00 В±0.13
PIN #1 INDEX AREA TOP VIEW END VIEW SIDE VIEW 0.50 В±0.07 (2x)
SUBSTRATE
#2 0.75 TYPICAL (REF) SOURCE
#1 0.45 REF.
x45В° 1.10 В±0.08 (2x) 0.70 В±0.08 #4
GATE 1.90 В±0.08 (4x) #3
DRAIN
0.10 TYPICAL (REF) 5.90 В±0.08 (2x)
BOTTOM VIEW NOTES:
1. The corner shape (radius, chamfer, etc.) may vary at the manufacturers option from that shown on the drawing.
2. The package thickness dimension is the package height before being solder dipped.
3. Dimensions are in millimeters. 1 3.750 0.000 2.150 3.750 2.650 Hermetic Packages for Integrated Circuits 2.250 2.250
#3 …
