Hermetic Packages for Integrated Circuits
Ceramic Metal Seal Flatpack Packages (Flatpack)
K28.A MIL-STD-1835 CDFP3-F28 (F-11A, CONFIGURATION B) A e 28 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE A INCHES PIN NO. 1
ID AREA -A-D -B-S1
b MILLIMETERS SYMBOL MIN MAX MIN MAX NOTES A 0.045 0.115 1.14 2.92 -b 0.015 0.022 0.38 0.56 -b1 0.015 0.019 0.38 0.48 -c 0.004 0.009 0.10 0.23 -c1 0.004 0.006 0.10 0.15 -D -0.740 -18.80 3 E1
0.004 M H A-B S Q D S 0.036 M H A-B S D S C E -D-A
-C-HE2 L
E3 SEATING AND
BASE PLANE c1 L
E3 (c) M
(b)
SECTION A-A NOTES:
1. Index area: A notch or a pin one identification mark shall be located adjacent to pin one and shall be located within the shaded
area shown. The manufacturer’s identification shall not be used
as a pin one identification mark. Alternately, a tab (dimension k)
may be used to identify pin one.
2. If a pin one identification mark is used in addition to a tab, the limits of dimension k do not apply.
3. This dimension allows for off-center lid, meniscus, and glass
overrun.
4. Dimensions b1 and c1 apply to lead base metal only. Dimension
M applies to lead plating and finish thickness. The maximum limits of lead dimensions b and c or M shall be measured at the centroid of the finished lead surfaces, when solder dip or tin plate
lead finish is applied.
5. N is the maximum number of terminal positions. …
