Plastic Packages for Integrated Circuits Package Outline Drawing
M48.240 48 LEAD THIN SHRINK SMALL OUTLINE PACKAGE (TSSOP)
Rev 1, 11/10
0.50 B 0.09-0.20 48 8.1 C
L 6.1В±0.10
4 0.20 C A B
2X N/2 TIPS 123
PIN 1 ID 0.17-0.27 SEE
DETAIL "A" 0.08 M C A B 5 BOTTOM VIEW TOP VIEW A 1.10 MAX
0.90В±0.05 0.05 (1.45) C 12.50В±0.10 (7.35) 0.05/0.15 4 0.10 C
SEATING
PLANE SIDE VIEW (12В°) TYP (1.00)
(46X 0.50) (48X 0.28)
0.25 PARTING
LINE TYPICAL RECOMMENDED LAND PATTERN H 3
(0-8В°) 0.6В±0.15
DETAIL "A"
SCALE: (NONE)
(VIEW ROTATED 90В° C.W.) NOTES:
1. All dimensions are in millimeters (angles in degrees).
2. Dimensioning & tolerances per ASME. Y14.5m-1994.
3. Datum plane H located at mold parting line and coincident
with lead where lead exits plastic body at bottom of parting line. …
