Package Intersil M24.173D — 数据表

Plastic Packages for Integrated Circuits Package Outline Drawing
M24.173D
24 LEAD HEAT-SINK THIN SHRINK SMALL OUTLINE PACKAGE (HTSSOP)
Rev 0, 10/09
A
1 3
5.49 В±0.10 7.80 В±0.10
SEE
DETAIL "X" 13 24 6.40
PIN #1
I.D. MARK 4.40 В±0.10
2
3 1 3.00 В±0.10 12 0.20 C B A B 0.65 EXPOSED THERMAL PAD 0.09 -0.20
END VIEW TOP VIEW BOTTOM VIEW 1.00 REF
H
0.05 C 0.90 +0.15/-0.10
1.20 MAX GAUGE
PLANE SEATING PLANE
0.19 -0.30 5
0.10 CBA 0.10C 0В°-8В°
0.60 В±0.15 0.00 MIN
0.10 MAX SIDE VIEW 0.25 DETAIL "X" (5.49) (1.45) NOTES:
1. Dimension does not include mold flash, protrusions or gate burrs. …