Plastic Packages for Integrated Circuits Package Outline Drawing
M24.173C
24 LEAD HEAT-SINK THIN SHRINK SMALL OUTLINE PACKAGE (HTSSOP)
Rev 1, 12/09
A
1 3
4.30 В±0.10 7.80 В±0.10
SEE
DETAIL "X" 13 24 6.40
PIN #1
I.D. MARK 4.40 В±0.10
2
3 1 3.00 В±0.10 12 0.20 C B A B 0.65 EXPOSED THERMAL PAD 0.09-0.20
END VIEW TOP VIEW H BOTTOM VIEW 1.00 REF 0.05 C
0.90 +0.15/-0.10 1.20 MAX GAUGE
PLANE SEATING PLANE
0.19 -0 .30
0.10 C 0.10 5 CBA 0В°-8В°
0.60 В±0.15 0.00 MIN
0.10 MAX SIDE VIEW 0.25 DETAIL "X" (4.30) (1.45) (5.65) (3.00) NOTES:
1. Dimension does not include mold flash, protrusions or gate burrs.
Mold flash, protrusions or gate burrs. Mold flash, protrusions or
gate burrs shall not exceed 0.15 per side. …
