Plastic Packages for Integrated Circuits Package Outline Drawing
M14.173B
14 LEAD HEAT-SINK THIN SHRINK SMALL OUTLINE PACKAGE (HTSSOP)
Rev 1, 1/10
A
1 3
3.10 В±0.10 5.00 В±0.10
8 14 SEE
DETAIL "X" 6.40
PIN #1
I.D. MARK 4.40 В±0.10
2 3.00 В±0.10 3 0.20 C B A
1 7
B 0.65 EXPOSED THERMAL PAD 0.15 +0.05/-0.06 BOTTOM VIEW END VIEW TOP VIEW 1.00 REF H
0.05
C
1.20 MAX SEATING
PLANE
0.25 +0.05/-0.06
0.10 C 0.10 0.90 +0.15/-0.10
GAUGE
PLANE 5 0.25 CBA
0В°-8В° 0.05 MIN …
