Plastic Packages for Integrated Circuits Package Outline Drawing
M14.173A
14 LEAD HEAT-SINK THIN SHRINK SMALL OUTLINE PACKAGE (HTSSOP)
Rev 2, 10/09
A
1 3
3.20 В±0.10 5.00 В±0.10
14 SEE
DETAIL "X" 8 6.40
PIN #1
I.D. MARK 4.40 В±0.10
2 3.00 В±0.10 3 1 7 0.20 C B A B 0.65 EXPOSED THERMAL PAD 0.09-0.20
END VIEW TOP VIEW BOTTOM VIEW 1.00 REF
0.05 H
C 0.90 +0.15/-0.10
1.20 MAX SEATING
PLANE GAUGE
PLANE
0.25 +0.05/-0.06 0.10 C 0.10 0.25 5
0В°-8В° 0.05 MIN
0.15 MAX CBA SIDE VIEW 0.60 В±0.15 DETAIL "X"
(3.20) NOTES:
(1.45) 1. Dimension does not include mold flash, protrusions or gate burrs. …
