Plastic Packages for Integrated Circuits
Small Outline Exposed Pad Plastic Packages (EPSOIC)
M28.3B N
INDEX
AREA H 0.25(0.010) M 28 LEAD WIDE BODY SMALL OUTLINE EXPOSED PAD
PLASTIC PACKAGE B M E INCHES
-B-1 2 SYMBOL 3 TOP VIEW
L
SEATING PLANE
-A-h x 45o A D
-C-A1 B
0.25(0.010) M C
0.10(0.004) C A M SIDE VIEW MAX NOTES A 0.091 -0.099 -0.001 -0.005 -B 0.014 -0.019 9 C 0.0091 -0.0125 -D 0.701 -0.711 3 E 0.292 -0.299 4 0.050 BSC -H 0.400 -0.410 -h 0.010 -0.016 5 L 0.024 -0.040 6 N О± B S NOMINAL A1 e О± e MIN 28
0В° 5В° 7
8В° -P 0.180 0.214 0.218 11 P1 0.156 0.190 0.194 11
Rev. 0 5/02 1 2 3 NOTES:
1. Symbols are defined in the “MO Series Symbol List” in Section
2.2 of Publication Number 95.
P1 2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate
burrs. Mold flash, protrusion and gate burrs shall not exceed
0.15mm (0.006 inch) per side. N
P …
