Plastic Packages for Integrated Circuits Package Outline Drawing
M8.118A
8 LEAD MINI SMALL OUTLINE PLASTIC PACKAGE (MSOP)
Rev 0, 9/09
A
3.0В±0.1
8 0.25 CAB 3.0В±0.1 4.9В±0.15 DETAIL "X" 1.10 Max
PIN# 1 ID B
SIDE VIEW 2
1 0.18 В± 0.05 2
0.65 BSC
TOP VIEW 0.95 BSC 0.86В±0.09 GAUGE
PLANE H
C 0.25 SEATING PLANE
0.33 +0.07/ -0.08
0.08 C A B 0.10 ± 0.05 3°±3° 0.10 C 0.55 ± 0.15
DETAIL "X" SIDE VIEW 1 5.80 NOTES: 4.40
3.00 1. Dimensions are in millimeters. 2. Dimensioning and tolerancing conform to JEDEC MO-187-AA
and AMSE Y14.5m-1994. 3. Plastic or metal protrusions of 0.15mm max per side are not
included. 4. Plastic interlead protrusions of 0.25mm max per side are not
included. 5. Dimensions “D” and “E1” are measured at Datum Plane “H”. 6. This replaces existing drawing # MDP0043 MSOP 8L. 0.65
0.40
1.40 …
